Thin Films Module Engineering - PhD Intern (Semiconductor Manufacturing)

Location: On-site in Hillsboro, Oregon, United States.

Salary: $120,898.00–$120,902.00 annual salary range for US roles.

Company

hirify.global Foundry develops semiconductor fabrication and manufacturing solutions across multiple technology nodes, including hirify.global 18A, hirify.global 3, and hirify.global 12nm.

What you will do

• Assist with developing and implementing thin-film manufacturing processes for a specific semiconductor production module.
• Support troubleshooting, maintenance, and qualification of manufacturing equipment.
• Collaborate with engineering, technology development, high-volume manufacturing, and cross-functional stakeholders to optimize process control and achieve production targets.
• Analyze data trends, formulate process-improvement solutions, and drive automation improvements, including the use of AI where applicable.
• Contribute to sustaining and improving manufacturing tools and processes while gaining hands-on semiconductor engineering experience.

Requirements

• Currently pursuing a PhD in a relevant STEM discipline, such as Physics, Applied Chemistry, Chemical Engineering, Electronic Engineering, Mechanical Engineering, or Computer Science.
• Strong analytical and problem-solving skills.
• Experience writing software code for applications in the relevant academic disciplines.
• Excellent written and verbal communication skills.
• Ability to work independently and as part of a diverse, high-performing team.
• Willingness to work in a cleanroom environment.
• Strong attention to detail and a disciplined approach to procedures.
• Data analysis skills, including the ability to construct clear data-based problem statements and design experiments.

Nice to have

• Experience with data analysis tools and software such as JMP, Python, Excel, and AI tools.
• Ability to summarize data for technical and non-technical audiences.

Culture & Benefits

• Work with the hirify.global Foundry and Manufacturing Development and Customer Engineering teams on semiconductor manufacturing innovation.
• Competitive compensation with stock bonuses and benefits including health, retirement, and vacation programs.
• Six-month internship schedule expected to begin in spring 2027 and continue through December 2027.
• Standard internship rates vary by degree, location, and job role.

Hiring process

• The recruiter can provide details about the specific compensation range for the preferred location and job role.
• Qualified applicants receive consideration without discrimination based on legally protected characteristics.