2027 Campus Product Development Engineer (Semiconductor)

Location: Shanghai, China; full-time onsite role.

Company

hirify.global develops inspection tools, metrology systems, process solutions, and computational analytics for semiconductor and electronics manufacturing.

What you will do

• Collaborate with multidisciplinary teams to develop and implement design improvements for released products and support next-generation product development.
• Participate in system design improvements, specification validation, solution implementation, development, and testing.
• Collect and analyze customer-site system data to identify sources of systematic or intermittent issues.
• Respond to complex field performance issues with written action plans by email, phone, or at global customer sites when field service engineers cannot resolve them.
• Prepare technical reports and design, execute, and review multidisciplinary experiments, detailed test plans, and system test summary reports.
• Coordinate root-cause analysis, work with service, manufacturing, engineering, and marketing teams, coordinate external suppliers, and maintain engineering prototype systems at the division headquarters.

Requirements

• Master’s or doctoral degree in engineering, physics, materials science, or a related field.
• Working knowledge of semiconductor manufacturing, optomechanical systems, wafer processing systems, and servo control systems.
• Experience with semiconductor industry yield and process-control instrument systems.
• Familiarity with data analysis tools such as JMP, Matlab, and Microsoft Excel.
• Good English communication skills for clear communication with cross-functional teams, department management, and external customers.
• Excellent teamwork skills and strong self-motivation.

Culture & Benefits

• Work alongside multidisciplinary engineering, service, manufacturing, marketing, and customer-facing teams.
• Opportunity to contribute to inspection, metrology, analytics, automation, motion control, sensor, platform design, and packaging technologies.
• Competitive total rewards package described as family friendly.
• Inclusive work environment and equal-opportunity employment commitment.
• Responsible use of AI is emphasized; AI or recording tools may not be used during interviews unless approved as an accommodation or invited by the interviewer.