Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Крутая вакансия
развернуть
Сильная роль в мировом лидере EDA. Требования четкие, а фокус на 3DIC и передовых техпроцессах делает эту позицию очень перспективной на рынке.
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Зарплата не указанаМощный доменАктуальный стекЧеткий scope
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Product Engineer II (EMX) (Electromagnetic Extraction): Enabling foundry PDK and design service teams to deliver signoff-ready on-chip electromagnetic modeling solutions with an accent on EMX technology enablement, foundry-qualified assumptions, and scalable reference flows. Focus on developing extraction methodologies for advanced nodes, large-scale SoCs, multi-die and 3DIC designs, and solving accuracy, convergence, and performance challenges.
Location: Shanghai, China
Company
hirify.global develops technology and software solutions for electronic design and semiconductor engineering.
What you will do
Support foundry PDK teams with the development, validation, and qualification of EMX technology files and electromagnetic modeling setups.
Collaborate with foundries to define modeling assumptions for BEOL interconnects, vias, MIM capacitors, inductors, and advanced process features.
Enable frequency-dependent R/L/C extraction, mutual coupling analysis, EM accuracy correlation, and foundry-level SI, PI, IR-drop, and EM signoff flows.
Ensure consistency between EMX models and downstream signoff tools including Quantus, Voltus, and Tempus, and validate settings against silicon data, reference designs, and correlation targets.
Develop and maintain EMX-based extraction reference flows for digital, analog, RF, and mixed-signal design services.
Support production designs, multi-die systems, 3DICs, and advanced packaging by addressing extraction scope, solver configuration, runtime, accuracy, convergence, and performance.
Requirements
Experience supporting foundry PDK or foundry design service teams with electromagnetic extraction and modeling flows.
Experience with EM modeling of BEOL interconnects, vias, MIM capacitors, inductors, and advanced process features.
Knowledge of frequency-dependent R/L/C extraction, mutual coupling, EM accuracy correlation, and signoff requirements.
Ability to integrate EMX extraction results into digital, analog, RF, and mixed-signal design flows.
Ability to configure solvers, evaluate runtime trade-offs, and resolve accuracy, convergence, and performance issues.
Knowledge of EM modeling requirements for advanced nodes, large-scale SoCs, multi-die systems, 3DICs, or advanced packaging.
Culture & Benefits
Full-time employment in Shanghai.
Work focused on technology development and solving complex semiconductor design challenges.
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