Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Чёткая ответственность за сложные SoC-программы в крупной полупроводниковой компании даёт серьёзный масштаб технического лидерства, но предполагает высокую нагрузку по координации и срокам.
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Масштабная зона ответственностиПонятные обязанностиКрупный игрок отраслиУзкая специализация
Оценка от Hirify AI
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Program Manager (SoC): Owning end-to-end SoC program execution from project definition through tape-out and post-silicon support with an accent on technical leadership, cross-functional coordination, and delivery readiness. Focus on managing architecture-to-silicon execution, resolving dependencies and risks, and coordinating tape-out, validation, and silicon bring-up.
Location: Tianjin (Teda), China
Company
hirify.global develops semiconductor products and SoC solutions.
What you will do
Own SoC program execution from project definition through tape-out and post-silicon support.
Drive technical decisions across architecture, integration, verification, implementation, validation, and system teams.
Lead and align Architecture, RTL, DFT, Verification, Emulation, Physical Design, AMS, IP, and related engineering teams.
Develop execution plans, monitor schedules, resources, critical paths, and risks, and drive recovery actions.
Coordinate with Product Marketing, System Architecture, System Engineering, NPI PM, BU management, and external stakeholders.
Own tape-out readiness and coordinate post-silicon validation, silicon bring-up, and issue resolution.
Requirements
Bachelor's degree or higher in Microelectronics, Electrical Engineering, or a related discipline.
6+ years of semiconductor industry experience.
Proven experience in SoC development from architecture through tape-out.
Strong understanding of SoC development flows, including Architecture, RTL Design, Integration, Verification, DFT, Emulation, Physical Design, and Silicon Validation.
Experience leading large cross-functional engineering teams.
Strong project execution, planning, and risk management skills.
Excellent communication, leadership, and stakeholder management capabilities.
Ability to influence technical direction and drive execution in a matrix organization.
Nice to have
Previous experience as a Chip Lead, SoC Technical Lead, Chief Engineer, or Project Technical Leader.
Experience with automotive, industrial, or safety-critical semiconductor products.
Experience working with global development teams across multiple sites.
Successful delivery of multiple SoC tape-outs and post-silicon product ramps.
Culture & Benefits
Cross-functional collaboration across architecture, engineering, product, business, and external stakeholder groups.
Work in a matrix organization requiring technical influence, communication, and stakeholder management.
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