Senior Principal Power/Hardware Engineer (Power Systems)

Location: On-site in Sunnyvale, California, United States, with an expectation to work from an HPE office 3+ days per week.

Salary: USD 181,000–367,000 annual base salary in California; variable incentives may also be offered.

Company

hirify.global is an edge-to-cloud technology company developing solutions for connecting, protecting, analyzing, and acting on data and applications.

What you will do

• Establish organization-wide architectures and methodologies for power hardware design across multiple platforms and organizations.
• Lead Board Mount Power and Front-End Power projects from architecture through design, validation, and manufacturing release.
• Evaluate emerging power technologies, innovations, outsourced development partners, and compliance with design standards.
• Drive integration of recommendations, technology updates, quality initiatives, and design standardization across power systems development.
• Conduct feasibility studies, design-margin and validation analyses, empirical testing, reliability evaluations, and thermal/emissions management analysis.
• Provide technical leadership, mentoring, cross-functional guidance, and communication with business-unit and executive stakeholders.

Requirements

• 12+ years of related power design engineering experience and a minimum BSEE degree.
• Experience with liquid-cooled power systems and high-voltage architectures, including ±400 VDC and 800 VDC input systems.
• Solid experience with schematic capture and simulation tools, including SPICE.
• Familiarity with multilayer PCB layout tools and techniques and power-development CAD tools such as Cadence Sigrity PowerDC.
• Strong understanding of industry standards, emerging power technologies, and power architecture requirements for networking and data center systems.
• Experience designing and integrating electronic components, integrated circuitry, algorithms, and complete electronic hardware architectures.
• Experience with circuit design, testing, verification, modeling, empirical analysis, and hardware validation.
• Knowledge of CAD tools and software packages for PCBA board design.
• Excellent written, verbal, and communication skills, with mastery of English and the local language and the ability to communicate nuanced technical concepts.
• Ability to communicate product architectures, present design proposals, and negotiate options and results at business-unit and executive levels.
• Participation in industry councils, technical committees, standards organizations, or other bodies influencing power-related specifications and standards for networking, telecommunications, and data center products.
• History of innovation with multiple patents in electronics.

Nice to have

• MSEE degree.
• Working knowledge of communication interfaces such as I2C and PMBus.
• Firmware design experience.

Culture & Benefits

• On-site work in an HPE office with flexibility to manage work and personal needs.
• Health and wellbeing benefits supporting employees and their loved ones.
• Personal and professional development programs supporting career growth and knowledge specialization.
• Inclusive workplace committed to valuing varied backgrounds and individual uniqueness.
• Accessibility accommodations are available during the application and interview process.