Senior Scientist, Advanced Packaging

Location: On-site in Marlborough, Massachusetts, United States.

Company

hirify.global develops materials and solutions for advanced electronics and high-tech industries.

What you will do

• Lead R&D of advanced copper electroplating chemistries for dual damascene semiconductor interconnect fabrication.
• Design and execute experiments to optimize copper filling in high-aspect-ratio trenches and vias.
• Develop additive systems including suppressors, accelerators, levelers, and related formulation components with the Material Innovation team.
• Investigate plating mechanisms using electrochemical, analytical, and materials characterization methods.
• Collaborate with process integration, analytical, engineering, manufacturing, customer-facing, and external partner teams.
• Scale technologies from laboratory development through pilot manufacturing and customer qualification, while supporting product roadmaps, intellectual property, technical publications, and customer and conference presentations.

Requirements

• Ph.D. in Chemistry, Chemical Engineering, Materials Science, Electrochemistry, or a related technical discipline.
• Strong understanding of electrochemistry and metal electrodeposition principles.
• Experience designing and analyzing statistically driven experiments.
• Proven record of technical innovation and problem solving.
• Excellent communication and presentation skills.
• Ability to work effectively in a multidisciplinary and customer-facing environment.

Nice to have

• Direct experience with electroplating for semiconductor applications.
• Knowledge of dual damascene integration and BEOL metallization processes.
• Familiarity with cyclic voltammetry, EIS, chronoamperometry, and chronopotentiometry at a rotating disk electrode.
• Understanding of electromigration, stress migration, and void formation reliability challenges.
• Experience transferring R&D technologies into manufacturing environments.
• Track record of patents, technical publications, and customer-facing technology development.

Culture & Benefits

• On-site work in Marlborough, Massachusetts.
• Collaborative environment spanning global teams, scientists, engineers, customer-facing account teams, and external partners.
• Work on advanced electronics, semiconductor metallization, interconnect scaling, and next-generation packaging technologies.
• Comprehensive pay and benefits package.
• Equal opportunity employer with reasonable accommodation support.