Senior Director - Platform Engineering (AI)

Location: Santa Clara, California, United States

Base pay: $213,240–$319,400 per annum, plus eligibility for bonus and equity plans.

Company

hirify.global develops semiconductor solutions and data infrastructure technologies for enterprise, cloud, AI, and carrier architectures.

What you will do

• Build, lead, and scale a multidisciplinary platform engineering organization across hardware, systems, validation, integration, and manufacturing engineering.
• Lead development of networking platforms, switch systems, complex boards, modules, and rack-scale infrastructure from concept through production.
• Drive system architecture decisions across hardware, software, mechanical, optical, thermal, power, signal integrity, and reliability domains.
• Establish board, system, and rack-level validation, automation, laboratory, quality, and production-readiness methodologies.
• Lead technical engagement with ODMs, subcontractors, suppliers, contract manufacturers, and manufacturing partners.
• Engage with hyperscale, cloud, and enterprise customers on requirements, design reviews, deployments, issue resolution, and technical escalations.

Requirements

• Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Systems Engineering, or a related discipline.
• 15+ years of leadership experience in networking, switching, data center infrastructure, or AI system development.
• Proven experience leading hardware and systems engineering organizations and scaling teams in high-growth environments.
• Deep expertise in networking and switch-based platform development, including complex boards and integrated systems.
• Extensive experience with system bring-up, validation, qualification, production deployment, and customer delivery.
• Hands-on experience with ODMs, subcontractors, suppliers, and contract manufacturers, plus experience creating engineering processes and governance frameworks.

Nice to have

• Experience with AI infrastructure, Ethernet switching, optical interconnects, or rack-scale architectures.
• Knowledge of Ethernet, PCIe, UALink, and other high-speed interconnect technologies.
• Experience supporting hyperscale customer deployments and large-scale board manufacturing.
• Experience leading globally distributed engineering organizations.
• PhD in a related field.

Culture & Benefits

• Opportunity to establish a new engineering function and define its operating model.
• Bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
• Employee stock purchase plan with a two-year look-back.
• Family support programs, mental health resources, and recognition and service awards.
• Access to technology and software may be subject to U.S. export control laws; export license review may apply to some applicants.

Hiring process

• Interview process evaluates individual experience, thought process, and communication in real time.
• Use of AI tools, transcription apps, automated answer generators, or automated note-taking bots during interviews is prohibited.