Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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$151к-226к/год
$170к$190кмедиана$190к
По похожим ролям (50) ~ $190к/год
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В Company hidden четко описана старшая инженерная роль в востребованной сфере полупроводников и инфраструктуры для ИИ; зарплата указана и соответствует рыночному уровню, также предусмотрены бонусы и акции. Основное ограничение - работа в офисе в Санта-Кларе.
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Только офисАктуальные инструментыВостребованная сфераПонятные задачиРыночная зарплата
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Principal Engineer (Signal Integrity): Defining, analyzing, and validating system interconnects for high-speed board, switch, and optical platforms with an accent on signal integrity simulation, package and PCB modeling, and lab-based correlation. Focus on evaluating 25–224G PAM4 interfaces, integrating optical interconnects, establishing SI/PI design guidelines, and resolving platform-level risks across cross-functional engineering teams.
Location: Santa Clara, California, United States
Expected base pay: $150,680–$225,700 per annum, excluding bonus and equity compensation.
Company
hirify.global develops semiconductor solutions for enterprise, cloud and AI, carrier, wired and wireless communications, and critical infrastructure applications.
What you will do
Define, analyze, and verify system interconnects for high-speed board, switch, and optical platforms.
Lead signal and power integrity simulations, package and PCB model generation, laboratory debugging, measurements, and simulation-to-hardware correlation.
Own timing assessments, package ballout specifications, bump/RDL specifications, and routing guidelines.
Support optical interconnect integration across board-to-module and module-to-switch interfaces.
Develop SI/PI methodologies, rules, workflows, and platform-level specifications while identifying and mitigating signal integrity risks.
Partner with circuit design, applications engineering, packaging, board layout, switch architecture, and customer engineering teams; mentor junior engineers.
Requirements
Bachelor’s degree in Electrical Engineering or a related field with 10–15 years of relevant experience, or a Master’s degree and/or PhD with 5–10 years of experience.
Strong knowledge of electromagnetic fundamentals, transmission line theory, via structures, high-speed connectors, and complex BGA packages.
Proficiency with 2D/3D electromagnetic simulation tools such as HFSS, Q3D, Sigrity Suite, or ADS, as well as HSPICE.
Hands-on experience using oscilloscopes, network analyzers, and TDR equipment.
Experience with high-speed PCB layout, package technology, optical module integration, and interfaces including DDR, PCIe, SerDes, USB, and SATA.
Strong analytical, debugging, communication, and customer-facing skills, with experience establishing SI parameters and design guidelines.
Nice to have
Experience setting up, running, and summarizing power integrity simulations.
Culture & Benefits
Work on complex cross-functional programs for next-generation data infrastructure platforms.
Bonus and equity plan eligibility, including a new-hire equity grant and annual equity refreshers.
Employee stock purchase plan with a two-year look-back.
Family support programs and mental and physical health resources.
Recognition and service awards.
Access to export-controlled technology may require eligibility under U.S. export control laws or an export license review.
Hiring process
Interviews assess individual experience, problem-solving approach, and communication skills.
AI tools, transcription apps, real-time answer generators, and automated note-taking tools are prohibited during interviews.
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