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6 дней назад

Principal Engineer (Signal Integrity)

150 680 - 225 700$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Principal Engineer (Signal Integrity): Defining, analyzing, and validating system interconnects for high-speed board, switch, and optical platforms with an accent on signal integrity simulation, package and PCB modeling, and lab-based correlation. Focus on evaluating 25–224G PAM4 interfaces, integrating optical interconnects, establishing SI/PI design guidelines, and resolving platform-level risks across cross-functional engineering teams.

Location: Santa Clara, California, United States

Expected base pay: $150,680–$225,700 per annum, excluding bonus and equity compensation.

Company

hirify.global develops semiconductor solutions for enterprise, cloud and AI, carrier, wired and wireless communications, and critical infrastructure applications.

What you will do

  • Define, analyze, and verify system interconnects for high-speed board, switch, and optical platforms.
  • Lead signal and power integrity simulations, package and PCB model generation, laboratory debugging, measurements, and simulation-to-hardware correlation.
  • Own timing assessments, package ballout specifications, bump/RDL specifications, and routing guidelines.
  • Support optical interconnect integration across board-to-module and module-to-switch interfaces.
  • Develop SI/PI methodologies, rules, workflows, and platform-level specifications while identifying and mitigating signal integrity risks.
  • Partner with circuit design, applications engineering, packaging, board layout, switch architecture, and customer engineering teams; mentor junior engineers.

Requirements

  • Bachelor’s degree in Electrical Engineering or a related field with 10–15 years of relevant experience, or a Master’s degree and/or PhD with 5–10 years of experience.
  • Strong knowledge of electromagnetic fundamentals, transmission line theory, via structures, high-speed connectors, and complex BGA packages.
  • Proficiency with 2D/3D electromagnetic simulation tools such as HFSS, Q3D, Sigrity Suite, or ADS, as well as HSPICE.
  • Hands-on experience using oscilloscopes, network analyzers, and TDR equipment.
  • Experience with high-speed PCB layout, package technology, optical module integration, and interfaces including DDR, PCIe, SerDes, USB, and SATA.
  • Strong analytical, debugging, communication, and customer-facing skills, with experience establishing SI parameters and design guidelines.

Nice to have

  • Experience setting up, running, and summarizing power integrity simulations.

Culture & Benefits

  • Work on complex cross-functional programs for next-generation data infrastructure platforms.
  • Bonus and equity plan eligibility, including a new-hire equity grant and annual equity refreshers.
  • Employee stock purchase plan with a two-year look-back.
  • Family support programs and mental and physical health resources.
  • Recognition and service awards.
  • Access to export-controlled technology may require eligibility under U.S. export control laws or an export license review.

Hiring process

  • Interviews assess individual experience, problem-solving approach, and communication skills.
  • AI tools, transcription apps, real-time answer generators, and automated note-taking tools are prohibited during interviews.

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