Engineer II-Equipment (Panelization)

Location: Philippines - Mphil 3

Company

hirify.global is a global semiconductor technology company with a large-scale manufacturing and engineering organization focused on developing technology products and advanced packaging solutions.

What you will do

• Develop, qualify, optimize, and sustain panel-level assembly processes for advanced semiconductor package manufacturing.
• Establish and maintain process parameters for die attach, chip attach, screen printing, plasma treatment, die matrix expansion, and carrier lamination.
• Provide day-to-day engineering support to production, troubleshoot process issues, and implement corrective and preventive actions.
• Support qualification, installation, release, and capability improvement of new process equipment.
• Analyze manufacturing data and drive yield enhancement, defect reduction, cycle time improvement, and cost reduction initiatives.
• Collaborate with Production, Maintenance, Quality, and Product Engineering teams on manufacturing performance and technology transfers.

Requirements

• Bachelor’s degree in Electronics, Mechanical, Manufacturing, Materials Science, Chemical Engineering, or a related engineering discipline.
• At least 3 years of Equipment Engineering experience, with the requirements also specifying 5–8 years of semiconductor manufacturing equipment support experience.
• Strong knowledge of semiconductor equipment systems, including mechanical and electrical systems, PLCs, sensors, and robotics.
• Experience with SPC, FMEA, process data analysis, technical schematics, manuals, and electrical diagrams.
• Experience troubleshooting automation systems and control software, plus familiarity with MS Office and maintenance management systems.
• Knowledge of chemical-handling safety protocols and cleanroom practices.

Nice to have

• Strong experience with WLCSP or advanced packaging tools.
• Experience with CMMS and quality methodologies such as DOE, GR&R, 8D, and CAPA.

Culture & Benefits

• Full-time employment in a large global semiconductor organization.
• Culture emphasizing trust, empowerment, respect, diversity, communication, employee development, and community.
• Access to structured leadership and career development programs.
• Travel requirement of 0–25%.