US Applications Engineering Team Leader (Semiconductor)

Location: Newark, Delaware, United States. Some travel is expected, up to 15% of the time.

Company

hirify.global develops materials and solutions for advanced electronics and high-tech industries, including products used in semiconductor fabrication.

What you will do

• Lead advanced R&D and applications development projects for new slurry products used in the Chemical Mechanical Planarization (CMP) process.
• Manage, train, and develop a team of applications engineers, including setting performance metrics and assigning technical resources.
• Serve as the primary technical liaison with key US-based semiconductor customers and support product and application development engagements.
• Guide Design of Experiments (DOE) for product development, scale-up, and commercialization of slurry and post-CMP cleaning products.
• Collaborate with R&D, sales, account management, and global product teams to translate customer and market needs into development activities.
• Troubleshoot and optimize internal and customer processes while meeting all safety requirements.

Requirements

• Bachelor’s degree or higher in chemistry, chemical engineering, mechanical engineering, materials science or engineering, or a related field.
• 10+ years of related experience with a bachelor’s degree; an M.S. or Ph.D. with 5+ years of related experience is preferred.
• Understanding of semiconductor fabrication, fab metrology, and related procedures.
• Experience with CMP technology, particularly CMP pad, CMP slurry, or post-CMP cleaning process development.
• Expertise in Design of Experimentation, statistical data analysis, technical reporting, and effective communication.

Culture & Benefits

• Work in a global advanced-electronics organization focused on new technology and innovation.
• Collaborate with cross-functional and global product teams.
• Opportunities for career growth within an industry leader.
• Comprehensive pay and benefits package.