R&D Process Engineer (Hybrid Bonding)

Location: Singapore, SGP; Science Park II, moving to Tampines starting from April 2027. Local and regional travel required approximately 10% of the time.

Company

hirify.global develops materials science and engineering solutions, equipment, and services for semiconductor chips and advanced displays.

What you will do

• Collect, analyze, and report data from process engineering experiments.
• Perform hardware characterization on basic systems and measure film properties.
• Troubleshoot process issues, perform root cause analysis, and support resolution of engineering problems.
• Prepare product documentation, presentations, and technical reports.
• Engage with customers to resolve process engineering concerns under supervision.
• Collaborate with vendors and suppliers and support implementation of new technologies, products, and analytical instrumentation.

Requirements

• PhD or Master’s degree in Materials Science, Chemical Engineering, Chemistry, Physics, or a related field.
• More than 3 years of semiconductor process development experience in Hybrid Bonding or other process modules.
• Good communication and interpersonal skills.
• Problem-solving attitude with a strong quality mindset.
• Ability to travel locally and regionally as required.

Nice to have

• Research experience focused on the semiconductor field.

Culture & Benefits

• Supportive environment focused on learning, development, and career growth.
• Opportunities to collaborate with R&D teams on advanced semiconductor and display research projects.
• Employee health and wellbeing programs and professional development support.
• Regular employment with full-time status.