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10 дней назад

IC Package Layout Engineer (Cadence Allegro)

Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
Israel
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
IC Package Layout Engineer (Cadence Allegro): Developing and releasing high-density IC package-substrate layouts for automotive digital and RF products with an accent on bump-to-ball routing, SI/PI constraints, and manufacturability. Focus on owning package layouts from feasibility through manufacturing release, resolving complex routing and verification challenges, and coordinating with substrate manufacturers and OSATs.

Location: Jerusalem, Israel; on-site

Company

hirify.global develops purpose-built hardware and AI technologies for advanced driver-assistance and autonomous-driving solutions.

What you will do

  • Own IC package-substrate layout from feasibility through manufacturing release.
  • Perform die placement, bump fan-out, ball-map planning, package-size estimation, layer planning, and stack-up definition.
  • Implement high-density routing for signal, power, and ground nets, including high-speed and RF interfaces.
  • Run DRC, connectivity, LVS/netlist, DFM, and manufacturing-data checks.
  • Generate artwork, fabrication drawings, reports, and release documentation.
  • Resolve layout-related queries from substrate manufacturers and OSATs.

Requirements

  • B.Sc. in Electrical Engineering or a related field, or equivalent practical experience.
  • 5+ years of hands-on IC package-substrate layout experience.
  • Strong proficiency with Cadence Allegro Package Designer.
  • Experience with flip-chip BGA, bump fan-out, ball-map optimization, and multilayer substrate routing.
  • Understanding of high-speed layout, differential pairs, length matching, spacing, return paths, power delivery, and power integrity.
  • Experience with DRC, connectivity verification, DFM, manufacturing-data release, and independently owning designs through release.

Nice to have

  • Experience with RF, SiP, multi-die, interposer, or 2.5D package layouts.
  • Experience with DDR, PCIe, SerDes, MIPI, or UFS interfaces.
  • Experience with Siemens Xpedition Package Designer or CAM350.
  • Experience working with substrate manufacturers and OSATs.
  • Scripting experience for package-layout automation.

Culture & Benefits

  • Work on automotive-grade hardware and AI technologies for advanced driver-assistance and autonomous-driving systems.
  • Collaborate with silicon, package, SI/PI, PCB, manufacturing, and OSAT teams.
  • Contribute to scalable hardware designed to support safer mobility worldwide.

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Jobs in Israel