Senior Integrated Photonics Packaging Engineer (AI)

Location: Stuttgart, Germany; onsite, full-time, permanent employment

Company

hirify.global develops photonic processing systems that compute with light as an energy-efficient alternative to transistor-based architectures for AI and high-performance computing.

What you will do

• Research, design, build, and validate electrical and optical packaging concepts for photonic integrated circuits.
• Develop packaging architectures for co-integration of PICs with light sources, photodetectors, and high-speed analog electronics.
• Lead packaging R&D workstreams from concept definition and experiment design through benchtop testing and knowledge transfer.
• Design and measure optical coupling schemes, including edge coupling, grating coupling, lensed fibers, and micro-lens arrays.
• Resolve optical, RF/microwave signal integrity, and thermal management challenges in collaboration with PIC, systems, and electronics teams.
• Document process recipes, assembly procedures, design rules, and tolerance budgets; coordinate with specialized technical suppliers and mentor junior engineers.

Requirements

• Master’s or Ph.D. in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field.
• 5+ years of hands-on R&D experience in photonic or optoelectronic packaging, hybrid integration, or high-density interconnect development.
• Experience developing and characterizing packaging prototypes that integrate PICs, laser sources or SOAs, photodetectors, and high-speed analog electronics.
• Strong knowledge of optical alignment and coupling, flip-chip and wire bonding, die attach, hermetic encapsulation, RF signal integrity, and thermal management.
• Hands-on experience with optical and electrical characterization, including insertion-loss measurement, far-field imaging, OLCR/OFDR, LIV testing, VNAs, and high-speed oscilloscopes.
• Fluent English is required; the role is based in Stuttgart.

Nice to have

• Ph.D. with an experimental packaging or integration focus.
• Experience with CAD layout tools and optical simulation software such as Zemax or Lumerical.
• Knowledge of German or another European language.

Culture & Benefits

• Work on photonic AI acceleration technologies validated in production HPC environments.
• Broad autonomy and decision authority with direct impact on packaging baselines and PIC module quality.
• Collaborate with an international, cross-functional team spanning photonics, processor design, and AI systems.
• Work in a transparent, fast-moving environment focused on technical excellence, open communication, and pragmatic problem-solving.
• Contribute to new institutional knowledge and potentially industry-defining intellectual property.