Staff Process Engineer (Die Attach)

Location: Seremban, Malaysia

Company

hirify.global operates in semiconductor manufacturing, with this role focused on die attach and die bond process engineering.

What you will do

• Lead and manage epoxy die attach, eutectic die bond, and other advanced die attach processes.
• Optimize processes to improve yield, eliminate defects, increase equipment utilization, and strengthen package reliability.
• Establish controls for die placement accuracy, bond line thickness, epoxy coverage, voids, die shear strength, and related KPIs.
• Lead process qualification, validation, NPI, package transfer, and volume ramp-up activities.
• Partner with Equipment Engineering to improve machine capability, preventive maintenance, uptime, OEE, and MTBA.
• Lead root cause analysis, corrective actions, customer audits, qualification reviews, and technical discussions.

Requirements

• Bachelor’s or master’s degree in Electrical, Electronic, Mechanical, Materials Science, Physics, or a related engineering discipline.
• At least 10 years of semiconductor assembly experience, including 5 or more years in die bond process engineering leadership.
• Expert knowledge of die bond processes, equipment, materials, epoxy attach, solder attach, sintering, and packaging reliability.
• Advanced knowledge of DOE, SPC, MSA, PFMEA, Control Plans, statistical analysis, and IQ/OQ/PQ validation.
• Experience managing engineers and technical teams in NPI, package transfer, and high-volume manufacturing environments.
• Familiarity with IATF16949, VDA, APQP, PPAP, FMEA, customer audits, and structured problem-solving methods.

Nice to have

• Knowledge of wire bond interaction effects and package reliability.
• Experience with JMP, Minitab, Excel, or equivalent data analytics tools.

Culture & Benefits

• Equal-opportunity and inclusive working environment.
• Access to employee resource groups, including Pride and women’s networks.
• Commitment to diversity, inclusion, and reasonable workplace adjustments.
• Opportunities to develop engineers, technicians, and operators through training, coaching, and mentoring.