Packaging Module Development Engineer (Semiconductor Packaging)

Location: On-site in Kulim, Malaysia

Company

hirify.global develops semiconductor technologies and high-volume manufacturing processes.

What you will do

• Develop solder ball attach, chip attach, component attach, and deflux processes for new products and test vehicles.
• Pathfind, qualify, and ramp materials and packaging technologies for high-volume manufacturing.
• Design experiments, analyze process data, and define process specifications using DOE and SPC.
• Optimize packaging processes for quality, reliability, cost, yield, productivity, and manufacturability.
• Study materials and process interactions, identify failure modes, assess technology feasibility, and make recommendations.
• Collaborate with cross-functional teams to build and evaluate material technologies on products and test vehicles.

Requirements

• BEng, MEng, MSc, or PhD in mechanical, materials, chemical, electrical, physics, or mechatronics engineering.
• More than two years of experience in electronic packaging and/or process development; strong fresh graduates may also be considered.
• Research and development experience, preferably in chip attach, deflux, or ball attach processes.
• Strong data analysis, problem-solving, written communication, and verbal communication skills.
• Ability to work under tight timelines and perform under pressure.

Culture & Benefits

• Full-time experienced-hire position.
• Shift 1 schedule in Malaysia.
• On-site work model.
• Employment practices follow local equal-opportunity requirements.