Engineer I Process Grinding and Lamination (Semiconductor)

Location: Philippines - Mphil 3

Company

hirify.global develops semiconductor technologies and products for applications across the technology industry, with a large global workforce and a focus on employee development and manufacturing innovation.

What you will do

• Develop, characterize, qualify, and industrialize wafer backgrinding, thinning, handling, and tape lamination processes for advanced semiconductor packaging platforms.
• Establish process architectures, flows, operating windows, critical parameters, standards, and technology roadmaps.
• Evaluate grinding technologies, materials, consumables, equipment, temporary wafer mounting systems, and handling solutions.
• Lead process transfers from development through pilot and high-volume manufacturing, including specifications, control plans, procedures, and qualification reports.
• Support manufacturing during technology ramp and early production, then drive process stabilization and continuous improvement.
• Collaborate with Product Development, R&D, Equipment Engineering, Operations, Quality, manufacturing teams, and external suppliers.

Requirements

• Bachelor’s degree in Electronics Engineering, Chemical Engineering, Materials Science Engineering, Mechanical Engineering, Semiconductor Engineering, Physics, or a related engineering discipline.
• At least 3 years of semiconductor manufacturing experience, including direct experience with backgrinding and tape lamination processes.
• Experience with Design of Experiments, Minitab or JMP, Statistical Process Control, FMEA, GR&R, and Six Sigma tools.
• Familiarity with process characterization, recipe creation, equipment and process troubleshooting, SPC data interpretation, safety protocols, and cleanroom practices.
• Strong analytical, problem-solving, communication, teamwork, leadership, mentoring, and attention-to-detail skills.
• Proficiency in Microsoft Office and maintenance management systems; experience with Fan-in, Fan-Out, or advanced packaging tools is highly preferred.

Culture & Benefits

• Full-time employment within a large global semiconductor organization.
• Culture centered on trust, empowerment, respect, diversity, communication, and values-based decision-making.
• Employee development supported through leadership and career growth programs.
• Travel requirement of 0%–25%.