Engineer I - Process (Semiconductor Manufacturing)

Location: Philippines - Mphil 3

Company

hirify.global is a global semiconductor technology company developing products and solutions for electronics applications.

What you will do

• Lead the development, characterization, qualification, and industrialization of die attach processes for advanced semiconductor packaging platforms.
• Define process architecture, process flows, critical parameters, operating windows, process margins, and technology roadmaps.
• Evaluate and implement die attach technologies, materials, consumables, equipment, and process solutions.
• Lead process transfers from development through pilot and high-volume manufacturing, supporting technology ramp and early production.
• Prepare process specifications, control plans, operating procedures, and qualification reports.
• Drive process stabilization, continuous improvement, and innovation in yield, reliability, metallization performance, throughput, and cost.

Requirements

• Bachelor’s degree in Electronics Engineering, Chemical Engineering, Materials Science Engineering, Mechanical Engineering, Semiconductor Engineering, Physics, or a related engineering discipline.
• At least 3 years of semiconductor manufacturing experience with direct die attach process experience.
• Experience with Design of Experiments, Minitab or JMP, Statistical Process Control, FMEA, GR&R, and Six Sigma tools.
• Familiarity with process characterization, recipe creation, and equipment or process troubleshooting.
• Strong analytical, problem-solving, communication, teamwork, leadership, and mentoring skills.
• Knowledge of safety protocols, cleanroom practices, MS Office, and maintenance management systems.

Culture & Benefits

• Full-time position with no travel required.
• Collaborative, team-oriented environment focused on trust, respect, diversity, communication, and accountability.
• Employee development and career growth programs.
• Work with advanced semiconductor products and manufacturing technologies.