Engineer I- Process (Die Attach)

Location: Philippines - Mphil 3; onsite

Company

hirify.global develops semiconductor technologies and products for applications across the technology industry.

What you will do

• Develop, characterize, qualify, and industrialize die attach processes for advanced semiconductor packaging platforms.
• Define process architecture, process flows, critical parameters, operating windows, and technology roadmaps.
• Evaluate and implement die attach technologies, materials, consumables, equipment, and process improvements.
• Lead process transfer from development through pilot and high-volume manufacturing.
• Prepare process specifications, control plans, operating procedures, and qualification reports.
• Support manufacturing ramp-up, process stabilization, continuous improvement, and early production activities.

Requirements

• Bachelor’s degree in electronics, chemical, materials science, mechanical, semiconductor engineering, physics, or a related engineering discipline.
• At least 3 years of semiconductor manufacturing experience with direct die attach process experience.
• Experience with Design of Experiments, Minitab or JMP, Statistical Process Control, FMEA, GR&R, and Six Sigma tools.
• Knowledge of process characterization, recipe creation, equipment and process troubleshooting, and SPC data interpretation.
• Knowledge of safety protocols and cleanroom practices, plus proficiency in MS Office and maintenance management systems.
• Strong analytical, problem-solving, communication, teamwork, leadership, mentoring, and attention-to-detail skills.

Culture & Benefits

• Full-time position within a global semiconductor organization.
• Employee development and leadership programs.
• Values-driven workplace emphasizing trust, empowerment, respect, diversity, communication, and community.
• Opportunities to contribute to technology innovation and advanced semiconductor manufacturing.