4 дня назад
Software Engineering PhD Intern New 2027 (Semiconductor)
149 598 - 149 602$
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
Software Engineering PhD Intern New 2027 (Semiconductor): Developing and optimizing computational software, simulations, and modeling methodologies for semiconductor process development and reliability with an accent on finite element methods, thermal transport, chip-package interactions, and thin-film patterning. Focus on designing scalable engineering solutions, validating simulation inputs and results, and applying physics-based and AI/ML approaches to complex manufacturing and reliability problems.
Location: On-site in Hillsboro, Oregon, United States
Annual salary: $149,598–$149,602 USD
Company
develops semiconductor technologies and operates a foundry technology organization focused on process innovation and future technology nodes.
What you will do
- Design, develop, and optimize computational software for engineering and research applications.
- Develop simulation capabilities using finite element, level-set, and related numerical methods.
- Create modeling methodologies for device, interconnect, process, module, and reliability challenges.
- Establish input criteria and methods for validating simulation results.
- Collaborate with software engineers, researchers, and domain experts to deliver scalable and maintainable solutions.
- Document technical solutions and present findings to project stakeholders.
Requirements
- Must be a full-time PhD student in electrical engineering, materials science, mechanical engineering, chemical engineering, or a semiconductor-related field.
- Minimum 3.0 GPA in college coursework to date.
- At least one year of programming experience in C, C++, Python, or equivalent.
- Strong analytical, problem-solving, and software development skills.
- On-site presence in Hillsboro, Oregon, United States is required.
Nice to have
- Experience with TCAD or atomistic simulation tools for thermo-mechanical and chip-package interactions, thermal transport, thin-film deposition, patterning, material interactions, or circuit performance.
- Hands-on experience developing or using finite element or equivalent solvers for physical systems.
- Experience with physics-based modeling and AI or machine learning for solid mechanics, thermal management, reliability, or semiconductor manufacturing processes.
Culture & Benefits
- Collaborative environment connecting software, mathematics, physics, and engineering.
- Health, retirement, and vacation benefits.
- Competitive pay and stock bonuses.
- Work on software and research solutions supporting semiconductor technology development.
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