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4 дня назад

Software Engineering PhD Intern New 2027 (Semiconductor)

149 598 - 149 602$
Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Software Engineering PhD Intern New 2027 (Semiconductor): Developing and optimizing computational software, simulations, and modeling methodologies for semiconductor process development and reliability with an accent on finite element methods, thermal transport, chip-package interactions, and thin-film patterning. Focus on designing scalable engineering solutions, validating simulation inputs and results, and applying physics-based and AI/ML approaches to complex manufacturing and reliability problems.

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $149,598–$149,602 USD

Company

hirify.global develops semiconductor technologies and operates a foundry technology organization focused on process innovation and future technology nodes.

What you will do

  • Design, develop, and optimize computational software for engineering and research applications.
  • Develop simulation capabilities using finite element, level-set, and related numerical methods.
  • Create modeling methodologies for device, interconnect, process, module, and reliability challenges.
  • Establish input criteria and methods for validating simulation results.
  • Collaborate with software engineers, researchers, and domain experts to deliver scalable and maintainable solutions.
  • Document technical solutions and present findings to project stakeholders.

Requirements

  • Must be a full-time PhD student in electrical engineering, materials science, mechanical engineering, chemical engineering, or a semiconductor-related field.
  • Minimum 3.0 GPA in college coursework to date.
  • At least one year of programming experience in C, C++, Python, or equivalent.
  • Strong analytical, problem-solving, and software development skills.
  • On-site presence in Hillsboro, Oregon, United States is required.

Nice to have

  • Experience with TCAD or atomistic simulation tools for thermo-mechanical and chip-package interactions, thermal transport, thin-film deposition, patterning, material interactions, or circuit performance.
  • Hands-on experience developing or using finite element or equivalent solvers for physical systems.
  • Experience with physics-based modeling and AI or machine learning for solid mechanics, thermal management, reliability, or semiconductor manufacturing processes.

Culture & Benefits

  • Collaborative environment connecting software, mathematics, physics, and engineering.
  • Health, retirement, and vacation benefits.
  • Competitive pay and stock bonuses.
  • Work on software and research solutions supporting semiconductor technology development.

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