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3 дня назад

CMOS FEOL Reliability Principal Engineer (2027 New College Graduate)

85 000 - 146 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
CMOS FEOL Reliability Principal Engineer (2027 New College Graduate) (Semiconductor Reliability): Supporting reliability qualification, physics analysis, lifetime modeling, and Process Reliability Monitoring for advanced CMOS technologies with an accent on HCI, BTI, TDDB, memory reliability, and statistical analysis. Focus on developing reliability models, automating data workflows with Python, MATLAB, JMP, or Excel, and solving qualification risks with cross-functional engineering teams.

Location: Malta, New York, USA

Salary: $85,000–$146,000 per year

Company

hirify.global manufactures essential semiconductors for high-growth markets, including AI, with a focus on power efficiency, performance, security, longevity, and sustainability.

What you will do

  • Support reliability qualification planning and execution for advanced semiconductor technologies.
  • Analyze CMOS reliability mechanisms, including HCI, BTI, TDDB, dielectric breakdown, SRAM, non-volatile memory, and power-device reliability.
  • Develop and review reliability models, lifetime extrapolations, statistical analyses, and Process Reliability Monitoring workflows.
  • Investigate technical issues and drive corrective actions with Device Engineering, Process Integration, Product Engineering, Test, Manufacturing, and Failure Analysis teams.
  • Prepare risk assessments, qualification reports, reliability reviews, technical documentation, and customer-facing presentations.
  • Improve analytics, automation, and monitoring tools using JMP, Python, MATLAB, Excel, or equivalent platforms.

Requirements

  • Graduating with a Bachelor’s, Master’s, or PhD in Electrical Engineering, Physics, Materials Science, Microelectronics, or a related field.
  • Overall GPA of at least 3.0 and good academic standing.
  • Written and verbal English fluency required.
  • Academic, research, internship, or project experience in semiconductor reliability, device engineering, technology qualification, semiconductor physics, or data analysis.
  • Foundational understanding of CMOS reliability mechanisms, statistical analysis, and reliability lifetime projections.
  • Strong analytical, problem-solving, written communication, teamwork, planning, and organizational skills.

Nice to have

  • Prior related internship or co-op experience, leadership experience, or graduate-level research.
  • Experience with advanced CMOS technologies, FinFET, FDSOI, SRAM, non-volatile memory, RF, analog, or power devices.
  • Knowledge of automotive reliability standards, including AEC-Q100.
  • Experience with Process Reliability Monitoring, reliability model development, semiconductor qualification, or customer-facing technical reviews.
  • Interest in using AI tools and emerging technologies to improve productivity and decision-making.

Culture & Benefits

  • Full-time employment for new college graduates.
  • Accelerated training in a fast-paced work environment.
  • Mentorship, networking, leadership opportunities, and cross-functional collaboration.
  • Opportunities for talent mobility and continuous improvement.
  • Commitment to workplace safety, environmental health, security, equal opportunity, and diversity.

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