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8 дней назад

Principal Member of Technical Staff RF Design Engineering

167 000 - 275 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Principal Member of Technical Staff RF Design Engineering (RFIC/RFSOI): Developing RF front-end building blocks including switches, antenna tuners, low-noise amplifiers, and digital, analog, and control circuits for 5G and Wi-Fi applications with an accent on RFIC design, electromagnetic simulation, silicon validation, and manufacturability. Focus on executing RFSOI tapeouts, correlating simulation with measured silicon performance, and translating customer requirements into reference designs and technical content.

Location: Santa Clara, United States

Expected salary range: $167,000–$275,000 per year

Company

hirify.global is a semiconductor foundry providing design, development, and fabrication services with a global manufacturing footprint.

What you will do

  • Design and develop RF switches, antenna tuners, low-noise amplifiers, and associated digital, analog, and control circuits for 5G FR1/FR3 cellular and Wi-Fi applications.
  • Perform RF IC schematic design, layout, parasitic extraction, electromagnetic simulations, and pre-silicon verification.
  • Design circuits for high manufacturing yield, reliability, ruggedness, and industry-standard ESD performance.
  • Define and execute characterization and validation plans, correlating simulations with measured silicon data.
  • Document architectures, simulations, design trade-offs, and tapeout results.
  • Engage customers and technology partners, create reference designs, and present technical content through webinars, events, white papers, and case studies.

Requirements

  • Master’s degree in electrical engineering or a related field with at least 8 years of relevant experience, or bachelor’s degree with at least 11 years of relevant experience.
  • Prior RFSOI experience, including relevant circuit tapeouts.
  • Deep knowledge of Cadence, EMX, ADS, tapeout procedures, corner analysis, DRC, and LVS checks.
  • Knowledge of communications system architecture and RF front-end architecture for cellular and Wi-Fi consumer products.
  • Experience engaging global customers and translating technical capabilities into application benefits.
  • Fluent written and spoken English required; travel up to 10%.

Nice to have

  • Ph.D. in electrical engineering or a related field with at least 7 years of relevant experience.
  • Production tapeouts of RFSOI switch, tuner, or LNA circuits in high-volume manufacturing.
  • Expertise in RF front-end architecture, specification definition, and system design.
  • Project management, planning, organizational, and communication skills.

Culture & Benefits

  • Full-time employment in a semiconductor manufacturing environment.
  • Commitment to environmental, health, safety, security, equal opportunity, and workplace diversity.
  • Reasonable accommodation is available during the employment process.

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