9 дней назад
Senior Director of Test Hardware Engineering
200 250 - 300 000$
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Senior Director of Test Hardware Engineering (Semiconductor/ATE): Leading the worldwide development, delivery, validation, and production ramp of ATE load boards, probe cards, sockets, and handler change kits with an accent on supplier management, high-speed SI/PI, manufacturability, and NPI execution. Focus on building a unified global hardware engineering organization, driving first-time-right designs, managing CAPEX/OPEX and capacity planning, and delivering long-term hardware strategies across manufacturing sites.
Location: Santa Clara, CA, United States; onsite role
Salary: $200,250–$300,000 per annum, plus eligibility for bonus and equity plans.
Company
develops semiconductor solutions that provide infrastructure for enterprise, cloud, AI, and carrier architectures.
What you will do
- Establish and lead a unified worldwide test hardware engineering organization covering development, ordering, repair, and capacity ramps.
- Lead the development, validation, NPI, and production support of ATE load boards, probe cards, sockets, and handler change kits.
- Define test engineering strategy, select equipment and vendors, and manage test hardware supplier relationships.
- Drive loadboard design strategy across schematic design, layout, SI/PI, simulation, thermal engineering, and mechanical engineering.
- Partner with Test Engineering, Product Engineering, Design Engineering, PTE, Supply Chain, and manufacturing teams.
- Own CAPEX/OPEX forecasting, headcount planning, recruiting, and long-term strategic roadmaps for executive leadership.
Requirements
- BS, MS, or PhD in Electrical Engineering, Mechanical Engineering, or a related field.
- 8–10 years of test or hardware engineering experience and 6–8 years in management.
- Proven experience leading teams through NPI and volume production in the semiconductor industry.
- Hands-on experience with ATE hardware design processes, including loadboards, probe cards, and sockets.
- Experience with CAPEX/OPEX ownership, budget forecasting, supply chain coordination, and long-term roadmap definition.
- Knowledge of PCB, MLO, probe head manufacturing, thermal and mechanical engineering, and SI/PI for high-speed Connectivity, Processor, ASIC, and AI designs.
Nice to have
- Established relationships with probe card, loadboard, and socket suppliers.
- Experience leading new technology qualification and directing hardware software tools and simulation processes.
Culture & Benefits
- Employee stock purchase plan with a two-year lookback.
- Bonus and equity plans, including new-hire equity grants and annual equity refreshers.
- Family support programs and mental and physical health resources.
- Recognition and service awards.
- Access to technology and software may be subject to U.S. export control laws and regulations.
Hiring process
- Interview process evaluates individual experience, thought process, and communication skills.
- AI tools, transcription apps, answer generators, and automated note-taking bots are not permitted during interviews.
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