Senior ASIC Package Design Engineer (Aerospace)

Location: United States — Remote

Company

hirify.global develops and mass-produces high-power satellite platforms for commercial and U.S. government missions from low Earth orbit to deep space.

What you will do

• Define ASIC package architectures for FC-BGA and MCM solutions, including substrate stack-ups, ball maps, power delivery, signal breakout, and mechanical constraints.
• Lead package-level trade studies covering cost, performance, power integrity, signal integrity, thermal management, manufacturability, and reliability.
• Establish package design standards, methodologies, and best practices for high-pin-count ASICs.
• Drive detailed FC-BGA design involving high-speed SerDes, dense power grids, RF signals, impedance control, escape routing, and reference planes.
• Partner with silicon, RF, and systems teams to co-optimize die floorplans, package interfaces, power delivery networks, decoupling, and thermal architecture.
• Manage packaging vendors, substrate suppliers, and OSATs through material selection, qualification, assembly optimization, and production ramp.

Requirements

• Bachelor’s degree in Packaging, Mechanical, Electrical Engineering, or a related field.
• 5+ years of ASIC package design experience with deep expertise in FC-BGA.
• Experience delivering high-pin-count, high-performance ASIC packages into production.
• Strong understanding of substrate technologies and materials, package-level SI/PI, and thermal management for power-dense ASICs.
• Fluency with SI/PI and electromagnetic simulation tools such as SIWave, HFSS, and ADS.
• Must qualify as a U.S. person under ITAR or otherwise be eligible for a federally issued export control license.

Nice to have

• Experience with MCM or heterogeneous integration, including chiplets, interposers, or advanced laminates.
• Background in high-speed digital or mixed-signal SoCs.
• Familiarity with aerospace, space, or high-reliability electronics.

Culture & Benefits

• Work on high-power satellite platforms designed for missions from LEO to deep space.
• Contribute to a fast-paced, high-growth, Series D-funded aerospace company.
• Employment accommodations are available for applicants and interview participants who need them.
• Equal opportunity employment based on merit, competence, and qualifications.