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5 дней назад

Principal / Sr. Principal Digital Design Engineer (AI)

185 000 - 230 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Principal / Sr. Principal Digital Design Engineer (AI): Architecting and implementing complex digital blocks and subsystems for high-performance AI connectivity solutions with an accent on RTL design, advanced CMOS technologies, timing closure, and DFT. Focus on taking designs from micro-architecture through production and silicon bring-up across PCIe, CXL, UALink, Ethernet, UCI, and DDR protocols.

Location: San Jose, California, United States

Salary: $185,000–$230,000 per year, depending on experience, level, and business needs. Discretionary bonus, incentives, and benefits may be available.

Company

hirify.global provides rack-scale AI infrastructure through semiconductor-based connectivity solutions and software for hyperscalers and ecosystem partners.

What you will do

  • Architect and implement complex digital blocks and subsystems for high-performance AI connectivity products.
  • Define micro-architecture and drive RTL implementation with optimized power, performance, and area trade-offs in advanced CMOS technologies.
  • Lead timing closure, DFT implementation, functional verification, coverage closure, and gate-level simulation activities.
  • Own third-party IP integration and block-level verification through sign-off.
  • Drive designs through production and collaborate with post-silicon teams on silicon bring-up and debug.
  • Mentor engineers and improve silicon development methodologies, CAD automation, and design infrastructure.

Requirements

  • Bachelor’s degree in Electrical Engineering or an equivalent field.
  • 10+ years of hands-on experience developing complex SoC or silicon products for server, storage, and/or networking markets.
  • Expertise in architecture definition, micro-architecture, RTL coding, functional simulation, and synthesis.
  • Strong knowledge of timing closure, gate-level simulation, DFT implementation, and Cadence and/or Synopsys digital design flows.
  • Deep expertise in at least one high-speed protocol, such as PCIe, CXL, Ethernet, DDR, or a similar technology.
  • Production experience with advanced CMOS nodes at 7nm or below.

Nice to have

  • Master’s degree in Electrical Engineering or a related field.
  • Experience delivering multiple high-performance designs to production in data-center environments.
  • Experience collaborating with embedded firmware teams and knowledge of RISC-V, Arm, or similar processor subsystems.
  • Contributions to design methodology, CAD automation, or design infrastructure.

Culture & Benefits

  • Work on connectivity technologies supporting AI infrastructure and hyperscale deployments.
  • Collaborate across design, verification, physical design, DFT, firmware, and post-silicon teams.
  • Inclusive environment that encourages applications from people with diverse backgrounds and experiences.
  • Potential eligibility for discretionary bonuses, incentives, and benefits.

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