Engineer I-Equipment (Wafer Fabrication)

Location: Lawrence, Massachusetts, United States; occasional support at the Lowell, Massachusetts facility. Primarily onsite at the fabrication facility, with a typical schedule of approximately 6:30 AM to 3:00 PM and some flexibility based on business needs.

Annual base salary: $70,304–$143,000, plus restricted stock units and quarterly bonuses.

Company

hirify.global is a global semiconductor technology company developing and manufacturing discrete devices and other products.

What you will do

• Troubleshoot, repair, maintain, and optimize manufacturing equipment.
• Improve systems and equipment to increase uptime.
• Work with equipment suppliers and vendors to resolve problems and identify upgrades.
• Research alternative replacement-part suppliers and technical solutions.
• Collaborate with process engineers to select new equipment and support tool installations.
• Lead equipment upgrade projects.

Requirements

• BSME, BSEE, or an equivalent degree.
• Strong mechanical aptitude and working knowledge of electronics.
• Ability to troubleshoot equipment to the component level and use DC test equipment.
• Experience analyzing data and using Microsoft Office.
• Strong written, verbal, and listening communication skills.
• Ability to read, write, and communicate in English; candidates must provide proof of US citizenship, permanent US residency, or protected-individual status under US export-control requirements.

Nice to have

• Experience with metal deposition, wafer etching, diffusion, photolithography, or related wafer-fabrication equipment.
• Experience repairing wafer-fabrication manufacturing equipment.
• CAD experience.

Culture & Benefits

• Collaborative, technology-driven environment focused on innovation and employee development.
• Health benefits beginning on the first day.
• Retirement savings plans and an employee stock purchase program with a two-year look-back feature.
• Travel requirement of 0%–25%.
• Work involves sitting, standing, walking, lifting, handling, crouching, kneeling, reaching, and exposure to noise or vibration.