Senior 3D Integration Engineer (Quantum Hardware)

Location: Aubervilliers, France; hybrid workplace

Company

Alice & Bob is developing a universal, fault-tolerant quantum computer based on superconducting Schrödinger cat qubits with autonomous quantum error correction.

What you will do

• Identify and benchmark 3D assembly technologies for quantum processing units against superconducting-circuit, microwave, material, process, and cryogenic constraints.
• Develop and qualify 3D integration building blocks, including airbridges, flip-chip bonding, TSV, multilayer wiring, superconducting interconnects, and wafer-level assembly.
• Coordinate integration test plans with fabrication, packaging, and other cross-functional hardware teams.
• Establish scalable and well-documented integration procedures to support system growth.
• Investigate integration issues and technical anomalies while ensuring alignment with specifications and performance targets.
• Serve as the technical point of contact for 3D integration with external foundries, packaging partners, and equipment vendors.

Requirements

• PhD or MSc in physics, materials science, electrical engineering, or microelectronics, with strong hands-on cleanroom experience.
• At least 3 years of 3D integration experience, including flip-chip or bump bonding and TSV processing.
• Experience developing and qualifying an integration process from literature review and test-vehicle design through experiments, data analysis, and go/no-go decisions.
• Knowledge of failure analysis and reliability assessment for 3D interconnects, including cross-sectioning, SEM, X-ray inspection or tomography, profilometry, and electrical test structures.
• Understanding of superconducting QPU fabrication and the material and interface requirements of cryogenic operation is beneficial.

Nice to have

• Experience with superconducting QPU fabrication and cryogenic materials or interfaces.

Culture & Benefits

• Flexible remote policy of up to 40% per month within the hybrid arrangement.
• BSPCE plan and additional intellectual-property compensation for patents defining the quantum architecture.
• 25 days of vacation plus RTT, parental support, and transportation or bicycle allowances.
• Health coverage, meal vouchers, mental health support, sports membership subsidy, and access to a stocked kitchen.
• French language courses and opportunities to share knowledge, develop ideas, and grow within an early-stage quantum technology startup.

Hiring process

• 30-minute screening call with Talent Acquisition.
• 45-minute hiring manager interview followed by a 90-minute technical interview and presentation with the team.
• 60-minute leadership and fit interview.