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10 дней назад

R&D Chemist II (Electroplating)

81 470 - 122 206$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
R&D Chemist II (Electroplating): Developing and optimizing electroplating chemistries, materials, and processes for semiconductor and advanced packaging applications with an accent on electrochemistry, materials characterization, and data-driven experimentation. Focus on designing DOE studies, understanding feature filling and deposit properties, and solving technical challenges across TSV, RDL, damascene, and hybrid bonding applications.

Location: Onsite laboratory role near Bridgeport, with Danbury listed as a secondary market.

Salary: $81,470–$122,206 per year, plus performance-related bonus.

Company

hirify.global develops electronic materials, electroplating chemistries, assembly materials, inks, pastes, and joining solutions for semiconductor, electronics, automotive, consumer, telecommunications, and infrastructure applications.

What you will do

  • Develop and optimize electroplating chemistries, materials, and processes for semiconductor and advanced packaging applications.
  • Conduct hands-on formulation, plating experiments, sample preparation, materials characterization, and data analysis.
  • Investigate plating mechanisms, chemistry interactions, feature filling, deposit properties, and process performance using electrochemistry and materials science.
  • Design and execute systematic experiments and DOE studies to optimize formulations and process conditions.
  • Use statistical analysis, data analytics, automation, and AI-assisted tools to accelerate experimentation and R&D productivity.
  • Collaborate with R&D, applications, engineering, product management, manufacturing, and analytical teams to support product development, scale-up, and commercialization.

Requirements

  • Bachelor’s degree in Chemistry, Chemical Engineering, Materials Science, or a related field; a master’s degree is preferred.
  • 3–5 years of relevant experience in electroplating, semiconductor wet processing, materials development, or related R&D.
  • Hands-on experience with electroplating, electrodeposition, or other wet chemical processes.
  • Knowledge of electrochemistry and materials science, with strong problem-solving, organizational, written, and verbal communication skills.
  • Ability to work independently and collaboratively in a multidisciplinary environment.
  • Experience with small hood-scale reactors and laboratory apparatus.

Nice to have

  • Experience with semiconductor or advanced packaging technologies such as TSV, RDL, damascene, or hybrid bonding.
  • Experience with analytical and materials characterization techniques.
  • Experience with DOE, statistical analysis, programming, automation, or AI-assisted scientific tools.
  • Synthesis experience with plating organic polymer additives.

Culture & Benefits

  • Collaborative, cross-functional environment focused on continuous improvement.
  • Health, dental, and vision insurance.
  • Wellness program, paid time off, holidays, and a 401(k) retirement plan with company match.
  • Paid parental leave, tuition reimbursement, and professional development opportunities.
  • Transparent management and opportunities for career growth.

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