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10 дней назад

MTS Technology Development Engineer (Semiconductor)

157 000 - 212 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
MTS Technology Development Engineer (Semiconductor): Developing and transferring process flows and macro modules for reliable, manufacturable Power Trench MOSFET and BCD devices with an accent on process integration, device characterization, and electrical performance. Focus on TCAD simulation, experiment design, test-lot analysis, layout-rule development, and solving process optimization challenges for first-pass manufacturing success.

Location: Bloomington, Minnesota, USA; onsite at the manufacturing facility

Salary: $157,000–$212,000 per year

Company

hirify.global develops and manufactures semiconductor devices, including Power Trench MOSFETs and BCD devices.

What you will do

  • Develop, transfer, optimize, and document process flows and front-end process modules for Power Trench MOSFET and BCD devices.
  • Set up TCAD process and device simulations, design experiments, and analyze data to define process sequences and parameters.
  • Characterize semiconductor devices and evaluate electrical, in-process, visual inspection, and failure-analysis data.
  • Support initial test-chip and transfer-lot processing, identify process issues, and drive first-pass manufacturing success.
  • Collaborate with Process and Device Engineering on process modules, layout rules, test structures, and mask-set development.
  • Provide development updates to management and external customers and support quality, safety, yield, and cost initiatives.

Requirements

  • Master’s or PhD in Electrical Engineering, Physics, Materials Science, or a related field.
  • 10+ years of experience in a relevant technology-development or process-integration role.
  • Experience with CMOS/BCDMOS or discrete IGBT/MOSFET process integration and silicon semiconductor device physics.
  • Knowledge of front-end process modules such as silicon, epitaxy, diffusion, etch, photolithography, and thin films.
  • Experience with process-flow design, electrical test data correlation, failure analysis, and manufacturability metrics.
  • Ability to use JMP or Spotfire, perform design-of-experiments analysis, run TCAD simulations, interpret layouts, and mentor junior engineers.

Nice to have

  • Experience with power packaging, assembly, reliability, contact and metallization, backend processes, and process or technology FMEAs.

Culture & Benefits

  • Health, dental, vision, disability, and life insurance.
  • 401(k) plan with company match and paid time off.
  • Annual bonus and tuition reimbursement.
  • Work includes exposure to hazardous chemicals, high voltages, and high equipment temperatures.

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