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5 дней назад

Lead Software Engineer (C++)

Формат работы
onsite
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
China
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Lead Software Engineer (C++/Finite-Element Simulation): Building and extending a production finite-element engine for electrothermal and thermomechanical simulation of advanced packages, 3D-IC stacks, and PCBs with an accent on numerical formulation, verification, and large-scale solver performance. Focus on implementing C++ features, debugging non-convergence and ill-conditioning, and optimizing parallel solutions for models with hundreds of millions of degrees of freedom.

Location: Shanghai, China

Company

hirify.global develops simulation products and finite-element software for advanced packages, 3D-IC stacks, and PCBs.

What you will do

  • Derive, implement, and verify finite-element formulations in production C++.
  • Develop unit and regression tests using analytical solutions and benchmark problems.
  • Profile and optimize solver and meshing code for runtime and memory performance on large models.
  • Debug non-convergence, mesh quality, ill-conditioning, and accuracy issues in customer cases.
  • Document formulations, assumptions, and validation results for reproducibility.
  • Collaborate with application engineering, QA, and product management to deliver features.

Requirements

  • PhD in Mechanical, Civil, Aerospace Engineering, Computational Mechanics, Applied Mathematics, or a related field; alternatively, an MS with 2+ years of relevant industry or research experience.
  • Strong knowledge of continuum mechanics and the finite element method, including weak forms, isoparametric elements, numerical integration, assembly, and Newton–Raphson methods.
  • Working knowledge of heat transfer or thermomechanical stress analysis, including thermal eigenstrain, CTE mismatch, and layered structures.
  • Strong C++11 or later skills, including pointers, memory ownership, templates, debugging, and extending large codebases.
  • Familiarity with sparse linear algebra and at least one sparse solver or library.
  • Clear written and spoken English and willingness to collaborate through technical review and knowledge sharing.

Nice to have

  • Development experience with a commercial or open-source FEA code such as Abaqus, ANSYS, LS-DYNA, COMSOL, Code_Aster, FEniCS, deal.II, or MOOSE.
  • Experience with nonlinear FEA, parallel programming, sparse solvers, graph partitioning, mesh generation, or computational geometry.
  • Background in semiconductor packaging or PCB engineering, including 3D-IC, HBM stacks, solder reliability, or warpage.
  • Experience developing on Windows and Linux with Git or Perforce.

Culture & Benefits

  • Hands-on R&D work with direct ownership of features from formulation through validation and performance optimization.
  • Collaboration with simulation developers, application engineers, QA, and product management.
  • Work on production software used to analyze industrial geometries and large-scale simulation models.

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