4 дня назад
College Intern - Process & Product Development in PVD Chambers in Hybrid Bonding for SOIC (Advanced Packaging)
Мэтч & Сопровод
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Описание вакансии
Текст:
TL;DR
College Intern - Process & Product Development in PVD Chambers in Hybrid Bonding for SOIC (Advanced Packaging) (PVD and advanced packaging): Developing and optimizing PVD processes for hybrid bonding in SOIC semiconductor packaging with an accent on metal film characterization, hardware experiments, and data analysis. Focus on troubleshooting complex process issues, performing root cause analysis, and developing next-generation semiconductor technologies under engineer guidance.
Location: Singapore, SGP
Company
develops materials science and engineering solutions, equipment, and services for semiconductor chips and advanced displays.
What you will do
- Perform and analyze complex experiments for physical vapor deposition (PVD) product development under engineer guidance.
- Optimize PVD processes and measure metal film properties.
- Organize experimental data and prepare reports for review.
- Characterize hardware on moderately difficult systems while following safety guidelines.
- Support troubleshooting, root cause analysis, and resolution of process engineering issues.
Requirements
- College intern or student status.
- Interest in semiconductor technologies, PVD processes, advanced packaging, and hybrid bonding.
- Ability to collect, organize, and analyze experimental data.
- Ability to follow safety guidelines during hardware characterization and experiments.
Culture & Benefits
- Supportive environment focused on learning, development, and career growth.
- Exposure to advanced semiconductor technologies and problem-solving for semiconductor foundries.
- Health and wellbeing programs supporting personal and professional development.
- No travel required.
- Relocation is not available.
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