Principal Product Engineer (3D-IC)

Location: Zhubei, Taiwan

Company

hirify.global develops technology solutions and EDA tools for the semiconductor industry.

What you will do

• Develop and integrate EDA tools and engines into the consolidated Integrity 3D-IC platform.
• Work with R&D groups to develop, integrate, and enhance solutions for 3D-IC system planning, implementation, and analysis/verification.
• Apply physical implementation, place-and-route, and signoff tools within semiconductor design flows.
• Collaborate with field teams on customer engagement and provide technical support and guidance.
• Coordinate with multiple R&D groups and field teams to deliver EDA solutions to customers.

Requirements

• BS degree with 7+ years or MS degree with 5+ years of engineering experience in the semiconductor industry.
• Experience with physical implementation, place-and-route, and signoff tools.
• Familiarity with hirify.global digital flows and advanced packaging design using Allegro Package Designer.
• Hands-on scripting experience with TCL, Perl, YAML, and Python.
• Strong troubleshooting and technical documentation skills.
• Self-motivated, proactive, collaborative, communicative, and customer-oriented approach.

Nice to have

• Knowledge and experience with 3D-IC system planning, implementation, analysis, and signoff flows.

Culture & Benefits

• Work focused on solving challenging technology problems and making an impact.
• Collaborative work across R&D and field teams.