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2 часа назад

Senior PCB Design Engineer (High-Speed Networking)

133 000 - 180 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Senior PCB Design Engineer (High-Speed Networking): Designing ultra-high-speed PCBs for enterprise networking, hyperscale data centers, and AI cluster platforms with an accent on 112G/224G PAM4 routing, optical transceiver interfaces, and signal and power integrity. Focus on developing dense multi-layer boards, optimizing 800G/1.6T optical module layouts, and supporting fabrication, assembly, and production ramp.

Location: Santa Clara, CA, USA

Salary: $133,000–$180,000 per year base pay, with potential bonuses and equity.

Company

hirify.global develops client-to-cloud networking solutions for data centers, campuses, routing environments, and next-generation AI clusters.

What you will do

  • Design and route ultra-high-speed PCBs for networking and Ethernet products, including 112G/224G SerDes, PCIe Gen 5/6, and DDR4/5/6 interfaces.
  • Develop PCB layouts for 800G and 1.6T optical transceiver platforms, including PAM4 channels, optical cages, and high-density BGA breakouts.
  • Optimize signal integrity through impedance control, insertion-loss budgeting, via backdrilling, return-path design, EMI control, and pre- and post-layout simulations.
  • Design power distribution networks and multi-phase DC/DC layouts for high-current ASICs and high-transient loads.
  • Coordinate thermal and mechanical integration, including thermal vias, heat sinks, airflow, enclosures, and optical cage placement.
  • Prepare manufacturing packages, maintain high-density footprints, define routing guidelines, and support products from feasibility through mass production.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering, Electronics, or a related field.
  • 10+ years of relevant hardware engineering experience and a track record of taking products from concept through mass production.
  • Experience designing networking hardware with 100G/200G PAM4 Ethernet switching and high-speed optical transceiver PCB layouts.
  • Advanced proficiency with Cadence Allegro and Sigrity, including 112G/224G PAM4 routing and channel optimization.
  • Experience with 20+ layer boards, 50G+ signals, sequential lamination, HDI, and ultra-low-loss materials.
  • Strong manufacturing knowledge covering DFM, DFA, and DFT for 30+ layer rigid and rigid-flex boards.

Culture & Benefits

  • Cross-functional collaboration with hardware design, signal integrity, power integrity, mechanical, thermal, and manufacturing engineering teams.
  • Work on high-performance networking platforms for enterprise campuses, hyperscale data centers, and AI clusters.
  • US-based employee benefits include medical, dental, vision, wellbeing, tax savings, and income protection.
  • Equal-opportunity and inclusive working environment.

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