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6 дней назад

Software Engineering - Intern, Graduate (AI)

111 098 - 111 102$
Формат работы
onsite
Тип работы
fulltime
Грейд
trainee
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Software Engineering - Intern, Graduate (AI) (software and semiconductor technology): Designing, developing, testing, debugging, and improving software that enables Intel products and platforms with an accent on scripting, automation, validation, and secure software tools. Focus on solving engineering challenges, collaborating with hardware and software teams, and contributing to AI, firmware, GPU, cloud, and systems software projects.

Location: On-site in the United States; primary location is Hillsboro, Oregon, with additional locations in Phoenix, Arizona; Folsom and Santa Clara, California; and Austin, Texas. Not available in Colorado. Relocation assistance may be available based on eligibility and role specifics.

Annual salary range: $111,098–$111,102 USD.

Company

hirify.global develops computing technologies spanning software, hardware, semiconductor manufacturing, and AI-powered platforms.

What you will do

  • Design, develop, test, debug, and improve software for hirify.global products and platforms.
  • Support code reviews, high-level design, scripting, automation, and validation activities.
  • Contribute to open, secure software platforms and tools.
  • Apply programming, data, and systems thinking to solve engineering challenges.
  • Collaborate with hardware, systems, product, and software teams.

Requirements

  • Currently pursuing a Master’s degree or PhD in Computer Engineering, Computer Science, Data Science, Electrical Engineering, Mathematics, or a related STEM field.
  • At least 3 months of relevant experience through coursework, academic projects, research, internships, co-ops, student organizations, assistantships, or similar technical work.
  • Availability to start in Spring or Summer 2027, with consideration for year-long internships or co-op opportunities.
  • Ability to work on-site in the United States.
  • Employment-based visa or immigration sponsorship is not available for this position.

Nice to have

  • GPA of 3.0 or higher.
  • Experience or interest in architecture, programming, scripting, data analysis, automation, modeling, simulation, validation, or debugging.
  • Hands-on coursework, research, project, or internship experience related to the role family.
  • Strong problem-solving, communication, collaboration, and teamwork skills.

Culture & Benefits

  • Hands-on work alongside experienced engineers and technical leaders.
  • Exposure to the full technology lifecycle, from research and design through semiconductor manufacturing and deployment.
  • Health, retirement, vacation, stock bonuses, and competitive compensation.
  • Opportunities to contribute to technologies used across computing and semiconductor applications.

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