обновлено 12 дней назад
Sr Device FA Engineer (Semiconductor)
Вакансия из Hirify Global, списка международных tech-компанийДля мэтча и отклика нужен Plus
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
Текст:
TL;DR
Sr Device FA Engineer (Semiconductor): Performing failure analysis on NAND memory products at wafer and finished-product levels with an accent on advanced methodologies, defect localization, and root-cause identification. Focus on developing state-of-the-art analysis capabilities, coordinating corrective actions across engineering teams, and automating workflows with AI/ML and data analytics.
Location: Shanghai, China; onsite at the Minhang Office
Company
develops Flash memory and advanced memory technology solutions supported by global manufacturing capabilities and advanced production facilities.
What you will do
- Perform failure analysis on memory product defects found during qualification, reliability testing, and customer return investigations.
- Analyze failures at wafer and finished-product levels using appropriate strategies, methodologies, and workflows.
- Prepare comprehensive failure analysis reports and collaborate with Product, Design, Process, and Reliability Engineering teams.
- Identify root causes and drive corrective actions for product defects.
- Maintain failure analysis case tracking, documentation, equipment, and laboratory operations.
- Develop advanced failure analysis methodologies for current and next-generation NAND technologies.
Requirements
- More than 3 years of relevant failure analysis engineering experience.
- Master’s degree in Materials, Electrical Engineering, or a related technical field.
- Knowledge of semiconductor manufacturing processes, memory product technology and structure, and memory product testing methodologies.
- Experience with advanced failure analysis tools and methods, including EFA, OBIRCH, EMMI, delayering, SEM with EDX, or FIB/TEM.
- Fluent English required for speaking, reading, and writing.
- Strong communication and presentation skills.
Nice to have
- Knowledge of memory theory and electrical failure analysis.
- Experience in NAND physical failure analysis and 3D NAND fabrication processes.
- Experience using AI/ML, computer vision, or data analytics to automate failure analysis workflows and improve defect localization.
Culture & Benefits
- Inclusive environment focused on diversity, belonging, respect, and contribution.
- Support and accommodation available for applicants with disabilities during the hiring process.
- Opportunity to work with global Flash memory manufacturing and technology teams.
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