Forward Deployment Leader (Thermal and Thermo-Mechanical Engineering)

Location: Remote within Europe, based in Munich, Germany; may require onsite work several days per week in Munich. Moderate travel within continental Europe and infrequent travel to Palo Alto, USA.

Compensation: SGD 1–SGD 2

Company

hirify.global is building Physics AI software for hardware design, combining physics simulation and machine learning to help engineers optimize semiconductor and complex hardware systems.

What you will do

• Build, lead, and scale a team of thermal and thermo-mechanical engineers.
• Support customer evaluations by setting up simulations, running test cases, and interpreting results.
• Partner with Sales on demonstrations, proof-of-concept evaluations, and technical discussions.
• Guide customer onboarding, deployment, training, and troubleshooting.
• Translate customer pain points and feedback into improvements with Product and Engineering.
• Represent hirify.global at semiconductor conferences and communicate competitive differentiators.

Requirements

• Degree in Mechanical, Electrical, or a related engineering field.
• 15+ years of hands-on experience with thermal management, mechanical warpage, stress, and reliability.
• Experience with commercial simulation software such as Flowtherm, Cadence, Ansys, Abaqus, or LS-DYNA.
• Scripting experience with Python or C++.
• Prior managerial or technical leadership experience.
• Strong customer-facing communication and ability to explain complex results to technical and business audiences.

Nice to have

• Experience with semiconductor electronics packaging, advanced packaging, foundries, chip or wafer warpage, and 2.5D/3D ICs.
• Pre-sales, technical sales, or customer-facing engineering experience.
• Experience commercializing EDA or simulation software for semiconductor and electronics companies.
• Familiarity with AI-assisted, physics-based design workflows.

Culture & Benefits

• Work at the intersection of AI, hardware engineering, and customer success.
• Collaborate with engineers and researchers in a fast-moving startup environment.
• Participate in work with leading engineering organizations and research institutions.
• Moderate travel within Europe with occasional collaboration involving the US team.