Digital Backend Design Engineer (IC Design)
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Описание вакансии
TL;DR
Digital Backend Design Engineer (IC Design): Implementing digital designs from RTL to GDSII with an accent on physical design, timing closure, power optimization, and verification. Focus on building full-chip and block-level implementation flows, solving advanced-node PPA and signal-integrity challenges, and preparing designs for tapeout and final signoff.
Location: On-site in Paris or Tel Aviv
Company
An early-stage AI and computer hardware company developing technologies at the intersection of artificial intelligence and semiconductors.
What you will do
- Execute full-chip and block-level physical design, including floorplanning, placement, clock tree synthesis, routing, and physical verification.
- Develop and optimize digital backend implementation flows using advanced EDA methodologies.
- Drive timing closure, power optimization, and PPA improvements.
- Perform LVS, DRC, ERC, IR drop, and electromigration analysis.
- Collaborate with RTL, DFT, packaging, and front-end design teams to resolve logical and physical interface issues.
- Support tapeout preparation and final signoff activities.
Requirements
- Master’s or PhD degree in Electrical or Electronic Engineering, or a related field.
- 4+ years of experience in digital IC backend implementation.
- Proficiency with Cadence Innovus and Genus.
- Strong knowledge of place and route, static timing analysis, DRC/LVS verification, IR drop, and electromigration analysis.
- Experience with advanced technology nodes, preferably 22nm or below, and hierarchical or full-chip implementation.
- Experience with Tcl scripting for backend flow automation; proficient English required.
Nice to have
- Experience with advanced hierarchical or full-chip implementation flows.
- French language skills.
Culture & Benefits
- Competitive cash compensation based on location, experience, and internal compensation benchmarks.
- Stock options are included in the majority of full-time offers.
- Relocation bonus and moving-expense coverage for relocation within 20 minutes of the company location.
- Healthcare coverage, pension contributions, professional development support, 25 days of paid time off, and public holidays.
- Ownership of a key technical domain with opportunities for technical and career growth.
- Multicultural, engineering-led, and high-paced working environment with public transport reimbursement of 50%.
Hiring process
- Screening call followed by a technical meeting about previous projects and achievements.
- CEO interview, reference calls with former managers, and a role-specific take-home technical assessment.
- Final interview to discuss the technical assignment and answer remaining questions.
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