Senior Packaging Engineer (Photonics)
Мэтч & Сопровод
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Описание вакансии
TL;DR
Senior Packaging Engineer (Photonics): Leading IC packaging initiatives from concept and design through manufacturing, NPI, and production ramp-up with an accent on heterogeneous integration, photonic packaging, and micro-scale optical alignment. Focus on designing high-yield packaging solutions, managing subcontractors and supply chains, and solving complex thermal, mechanical, electromagnetic, and industrialization challenges.
Location: On-site at the Paris offices, France. Relocation support is available for relocation within 20 minutes of the company location.
Company
AI and computer hardware company developing technologies at the intersection of artificial intelligence, semiconductors, photonics, electronics, and machine learning.
What you will do
- Lead IC packaging initiatives from conceptual design and simulation through manufacturing process selection, NPI, and ramp-up.
- Design packaging solutions from initial drawings and simulations to design for manufacturing.
- Establish the packaging supply chain and identify, vet, and manage external subcontractors.
- Collaborate with IC design, optical, and PCB teams to align cross-domain packaging specifications.
- Lead chip industrialization activities focused on high yield and Cpk.
- Conduct failure analysis, debugging, and production issue resolution.
Requirements
- Master’s degree in Electrical Engineering or Integrated Circuits Design.
- 5+ years of experience in semiconductor and photonic packaging.
- Expertise in heterogeneous integration, wafer dicing, Cu pillars, advanced bumping, flip-chip, redistribution layers, encapsulation, die attach, bonding, wirebonding, and 2.5D/3D integration.
- Strong experience with photonic and optoelectronic packaging, passive and active optical alignment, sub-micrometer die placement, and InP or GaAs semiconductors.
- Proficiency in thermal, mechanical, and electromagnetic simulations, plus packaging industrialization, production flows, high-yield manufacturing, and failure analysis.
- Proficient English required; French is a plus.
Nice to have
- Experience with Six Sigma methodology.
Culture & Benefits
- Competitive cash compensation based on location, experience, and internal pay equity.
- Meaningful stock options included in most full-time offers.
- Relocation bonus and moving expense coverage for eligible relocation near the company location.
- Healthcare coverage, pension contributions, professional development support, 25 days of PTO, and public holidays.
- 50% reimbursement of the public transport subscription fee.
- High-paced, multicultural, engineering-led environment with ownership of a key technical domain and opportunities for growth.
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