Internship - Package Mechanical Simulation (Semiconductors)

TL;DR

Internship - Package Mechanical Simulation (Semiconductors): Developing predictive modeling algorithms for solder joint microstructures and reliability analysis with an accent on computational materials science and mechanical loading simulations. Focus on translating theoretical frameworks into robust computational implementations and validating results against experimental data.

Location: Nijmegen, Netherlands (Onsite)

Company

hirify.global is a global leader in secure connectivity solutions for embedded applications, driving innovation in the automotive, industrial, and IoT markets.

What you will do

• Develop algorithms to simulate solder joint microstructure evolution under thermal and mechanical loads.
• Implement theoretical scientific formulations into NXP's existing simulation framework.
• Enhance tools for generating realistic microstructures and assigning material properties.
• Investigate degradation mechanisms to evaluate package reliability and performance.
• Validate simulation outcomes against experimental data and literature benchmarks.
• Document methodology and findings in a final technical report and presentation.

Requirements

• Must be currently pursuing a Master's degree in Mechanical Engineering, Materials Science, Physics, Computational Engineering, Applied Mathematics, or Electrical Engineering.
• Strong interest in materials modeling, reliability engineering, or semiconductor packaging.
• Proficiency in programming and scientific computing using Python, MATLAB, or C++.
• Familiarity with numerical modeling techniques such as finite element methods or multi-physics simulations.
• Ability to interpret scientific literature and translate concepts into computational algorithms.
• Strong analytical, problem-solving, and technical communication skills.

Culture & Benefits

• Opportunity to work at the intersection of academic research and industrial engineering.
• Access to professional development through online and offline learning opportunities.
• Commitment to an inclusive work environment with active diversity and equality programs.
• Contribution to sustainable and innovative semiconductor packaging technologies.