Назад
Company hidden
2 дня назад

Design Engineering Manager (Power Management)

Формат работы
remote (только USA)
Тип работы
fulltime
Грейд
lead
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/

TL;DR

Design Engineering Manager (Power Management): Leading the development of next-generation power management technologies through advanced analog and mixed-signal IC design with an accent on high-voltage gate drivers and intelligent power modules. Focus on architecting high-performance solutions, mentoring engineering teams, and driving successful silicon tape-outs.

Location: Must be based in the United States

Company

hirify.global is an AI-powered recruitment platform facilitating connections between top-tier engineering talent and partner companies.

What you will do

  • Define and architect high-voltage power management solutions including gate drivers and protection circuits.
  • Lead transistor-level analog and mixed-signal design, simulation, and verification.
  • Drive the integration of passive silicon capacitor technologies into multi-chip modules.
  • Own the IC development lifecycle from schematic design through tape-out execution.
  • Partner with test engineering to characterize and debug first silicon in the laboratory.
  • Provide technical leadership and mentorship to junior and mid-level engineers.

Requirements

  • Must be based in the United States
  • Master’s or Ph.D. degree in Electrical Engineering or related discipline.
  • 7+ years of hands-on IC design experience with successful production tape-outs.
  • Deep expertise in high-voltage gate driver architectures and power management circuit design.
  • Advanced proficiency with EDA tools such as Cadence Virtuoso and Spectre.
  • Strong laboratory debugging skills using oscilloscopes and high-voltage testing equipment.

Nice to have

  • Experience with GaN and SiC power FET driving requirements.
  • Familiarity with advanced multi-chip module (MCM) packaging and System-in-Package (SiP) design.

Culture & Benefits

  • Competitive compensation package based on expertise.
  • Remote work flexibility.
  • Opportunity to contribute to cutting-edge semiconductor technologies.
  • Collaboration with highly skilled cross-functional engineering teams.
  • Inclusive workplace environment focused on professional development.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →