Head of Trading Infrastructure

TL;DR

Head of Trading Infrastructure (Low-latency C): Lead the architecture, development, and evolution of a global exchange connectivity platform for market data ingestion, order entry, and historical market data across multiple exchanges and asset classes with an accent on low-latency, scalable feed handler and order gateway frameworks. Focus on designing reusable connectivity architecture, improving latency reliability scalability and performance, and setting quality standards across production research and simulation environments.

Company

Quantitative trading firm building high-performance technology for global electronic trading.

What you will do

• Lead strategy and technical direction for the firm’s exchange connectivity platform.
• Design and deliver scalable feed handler and order gateway frameworks across global markets.
• Build standardized architecture to support rapid onboarding of new exchanges and asset classes.
• Drive improvements in latency, reliability, scalability, and overall system performance.
• Establish quality standards for live and historical market data across production, research, and simulation environments.
• Lead and grow an engineering team through hiring, mentoring, architecture reviews, and delivery standards; collaborate with exchanges and connectivity partners.

Requirements

• Extensive experience building low-latency trading infrastructure in a quantitative trading firm, market maker, exchange, or financial institution.
• Strong background in exchange connectivity, including feed handlers, market data platforms, and order entry gateways.
• Expert knowledge of modern C and performance-critical software development.
• Deep understanding of network protocols, concurrency, memory management, and latency optimization.
• Experience leading engineering teams and delivering large-scale distributed systems.
• Strong understanding of market data architecture, exchange protocols, and trading system design.

Culture & Benefits

• Senior leadership role with significant technical ownership.
• Competitive salary package with performance-based incentives.
• Relocation support available for suitable international candidates.
• Flexible location across Hong Kong or Singapore.