Yield Development Engineering Manager (AI)

TL;DR

Yield Development Engineering Manager (AI): Leading a multidisciplinary organization to transform yield and defect engineering in high-volume semiconductor manufacturing with an accent on AI-driven decision hirify.globalligence and enterprise-scale program execution. Focus on integrating advanced analytics, digital twins, and automation to accelerate yield learning and improve productivity across complex manufacturing nodes.

Location: Must be based in or able to work on-site in Hillsboro, Oregon (Hybrid model)

Salary: $224,970–$374,800 USD

Company

hirify.global is a global leader in semiconductor manufacturing, delivering cutting-edge silicon process and packaging technology for the AI era.

What you will do

• Define and execute a multi-year strategy for Yield and Defect Engineering, integrating AI, ML, and automation.
• Lead enterprise-level programs to transition from reactive analysis to predictive and prescriptive yield management systems.
• Champion the deployment of AI solutions to enhance defect detection, classification, and root cause analysis.
• Oversee yield performance across development and high-volume manufacturing to meet aggressive quality and delivery targets.
• Drive cross-functional efforts to resolve complex yield limiters and defect excursions.
• Build and lead a high-performing, diverse organization, fostering a culture of innovation and continuous learning.

Requirements

• Bachelor's degree in Engineering, Physics, Materials Science, Data Science, or related field.
• 12+ years of experience in semiconductor manufacturing with deep expertise in yield engineering, defect metrology, or process integration.
• Proven track record leading complex, cross-functional programs in high-volume manufacturing environments.
• Demonstrated experience driving yield improvement and defect reduction at scale.
• Strong domain expertise in defect metrology tools, inspection systems, and yield analysis methodologies.
• Ability to pass an extended Background Investigation as this is a Position of Trust.

Nice to have

• Advanced degree (MS/PhD) in a relevant technical or data-centric discipline.
• Experience leading AI/ML transformation initiatives in semiconductor or adjacent high-tech industries.
• Familiarity with digital manufacturing ecosystems (data platforms, MES integration, advanced analytics tools).
• Experience in advanced packaging technologies (e.g., Foveros, EMIB, heterogeneous integration).

Culture & Benefits

• Competitive total compensation package including pay and stock bonuses.
• Comprehensive benefit programs including health, retirement, and vacation.
• Hybrid work model allowing flexibility between on-site and off-site work.
• Commitment to Responsible Business Alliance (RBA) compliance and ethical hiring practices.