R&D Test Engineer, Thermal/Mechanical/Reliability (AI Chips)

TL;DR

R&D Test Engineer (AI Chips): Executing thermal and reliability testing and designing custom hardware fixtures for single-crystal diamond applications on AI chips with an accent on thermal characterization and industry-standard reliability validation. Focus on building experimental apparatus and solving complex hardware assembly challenges for customer prototyping.

Location: On-site in San Jose, California

Company

hirify.global develops high-performance single-crystal diamond solutions for next-generation AI chips.

What you will do

• Design and develop mechanical fixtures and experimental apparatus using CAD software for customer prototyping.
• Coordinate accelerated lifetime reliability and environmental stress testing per industry standards to validate package integrity.
• Build, operate, and troubleshoot thermal characterization test platforms for AI customer hardware.
• Develop assembly processes for prototype hardware, including thermal interfaces and mounted cooling solutions.
• Manage project schedules, technical risks, and cross-functional communication.

Requirements

• BS or MS in Mechanical Engineering or a related discipline.
• 2+ years of experience in mechanical/thermal engineering, test engineering, or product development.
• Experience with laboratory instrumentation and data acquisition systems.
• Proficiency with CAD software (SolidWorks preferred).
• Experience creating engineering drawings and performing data analysis using MATLAB, Python, or Excel.
• Must be based in San Jose, California for on-site work.

Nice to have

• Experience with thermal testing/characterization for packaged devices and liquid cooling solutions.
• Familiarity with FEA and CFD tools such as ANSYS Mechanical/Fluent, Icepak, or COMSOL.
• Knowledge of IC packaging, metrology, or failure analysis.