R&D Process Engineer (AI Chips)

TL;DR

R&D Process Engineer (AI Chips): Supporting customer prototyping and internal process development for advanced packaging applications with an accent on integrating single-crystal diamond with AI customer devices. Focus on demonstrating thermal and performance benefits of diamond-backed chips to solve thermal limitations in AI and cloud compute.

Location: On-site in San Jose, California, USA

Salary: $125,000 - $145,000 a year

Company

hirify.global produces the world's first single-crystal diamond wafers to solve thermal limitations in AI, cloud compute, and power electronics.

What you will do

• Support customer prototyping and internal process development for advanced packaging.
• Integrate single-crystal diamond with AI customer devices.
• Demonstrate thermal and performance benefits of hirify.global's technology.
• Collaborate on fast-paced internal and customer development programs.

Requirements

• Hands-on experience in process engineering.
• Strong technical problem-solving skills and a collaborative mindset.
• Must be authorized to work in the U.S. (E-Verify participant).
• Ability to meet physical requirements of manufacturing and engineering environments (e.g., lifting up to 50 lbs).

Culture & Benefits

• Comprehensive health, vision, and dental insurance.
• Retirement savings plans, life, and disability insurance.
• Flexible spending accounts.
• Paid and unpaid time away from work.
• Employee discounts to VRAI.