Senior/Staff Mid-End Engineer (3D/Process Integration)

Location: Malaysia / Singapore

Company

hirify.global is a technology company focused on Bitcoin mining infrastructure, ASIC design and manufacturing, datacenters, and AI cloud computing.

What you will do

• Own the wafer-on-wafer and hybrid-bonding stack definition, including TSV interfaces, bond-pad arrays, keep-outs, and alignment budgets.
• Drive 3D-aware floorplanning, bump and TSV maps, micro-bump and ballmap planning, and die-to-die interface placement.
• Define and close DFM and 3D design rules, and lead design-rule and process-assumption reviews.
• Coordinate thermal and thermal-mechanical analysis, including stress and warpage, and feed mitigations into floorplan, power-delivery, and stack decisions.
• Drive thermal, SI/PI, and known-good-stack signoff before tapeout, while coordinating the 3D test strategy with DFT.
• Manage package and substrate co-design handoff to the OSAT, and track foundry and memory-partner deliverables, risks, and milestones.

Requirements

• BS, MS, or PhD in electrical engineering, materials engineering, mechanical engineering, or a related field.
• 5+ years of experience in 3DIC, advanced packaging, or process integration, including at least one product taken through tapeout and assembly.
• Hands-on experience with TSV, hybrid bonding, and a 3D stacking flow such as wafer-on-wafer, chip-on-wafer, SoIC, or CoWoS-class integration.
• Working knowledge of TSMC 3DFabric or an equivalent foundry 3D ecosystem, including design kits and rule decks.
• Strong understanding of thermal and thermal-mechanical behavior in stacked die and SI/PI at die-to-die interfaces.
• Ability to manage cross-organization interfaces with foundries, memory IP partners, and OSATs.

Nice to have

• Experience with DRAM-on-logic stacks, HBM-class memory integration, or high-bandwidth memory interfaces.
• Background with AI or HPC accelerators and other high-power, high-bandwidth SoCs.
• Familiarity with Ansys and 3D physical or signoff flows using Synopsys or Cadence.
• Experience with stacked-die test, yield debugging, or establishing a 3D-integration methodology on a small team.

Culture & Benefits

• Inclusive environment that values authenticity and diverse perspectives.
• Startup-oriented atmosphere with open workspaces and opportunities to connect with industry specialists.
• Direct contribution to projects in the digital asset and AI infrastructure industries.
• High autonomy, personal accountability, and opportunities to shape new processes and systems.
• Training, mentoring, welfare benefits, and professional development opportunities.