College Intern - GT Indigo Inter-Die Gapfill Process and Integration for 3DIC

Location: Singapore, SGP

Company

hirify.global develops materials science and engineering solutions, equipment, and services for semiconductor manufacturing and advanced displays.

What you will do

• Support the development, characterization, and optimization of thin-film deposition processes for advanced semiconductor packaging.
• Design and execute process engineering experiments, perform wafer processing, and run experiments according to defined procedures.
• Collect and analyze process and metrology data covering thickness, uniformity, refractive index, stress, composition, surface roughness, and electrical properties.
• Use statistical methods and data visualization to identify trends, correlations, and process improvement opportunities.
• Support troubleshooting, root cause analysis, corrective actions, and technical documentation.
• Collaborate with process, hardware, manufacturing, and product engineering teams and present project results to engineering leadership.

Requirements

• Knowledge of semiconductor manufacturing processes.
• Basic understanding of thin-film deposition, plasma processing, or surface science.
• Experience with experimental design and data analysis.
• Strong analytical and problem-solving skills.
• Effective verbal and written communication skills.
• Ability to work independently and collaboratively.

Nice to have

• Experience or interest in low-temperature dielectric deposition, advanced packaging materials, wafer bonding, gap-fill process development, film characterization, or process hardware characterization.
• Knowledge of process automation, data analytics, or AI-assisted process optimization.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Hands-on exposure to semiconductor manufacturing equipment and advanced packaging technologies.
• Health and wellbeing programs supporting personal and professional growth.
• No travel required.
• Relocation is not eligible for this position.