Semiconductor Package Competence Engineer

TL;DR

Semiconductor Package Competence Engineer (Semiconductors): Leading the functionality and performance of semiconductor packages with an accent on architectural design and technical roadmapping. Focus on collaborating with global development teams, analyzing market trends, and proposing innovative packaging solutions.

Location: Hamburg, Germany

Company

A global leader in semiconductor manufacturing, dedicated to innovation and inclusive team environments.

What you will do

• Act as a Package Architect with responsibility for the functionality and performance of semiconductor packages.
• Interface with the global package and assembly development community.
• Collect and analyze technical customer needs, market trends, and benchmarking data.
• Propose and develop innovative packaging solutions.
• Provide package expertise across all Business Group functions.
• Manage package requirements and roadmaps aligned with product strategy.

Requirements

• Master’s degree or PhD in Semiconductor Packaging, Chemistry, Physics, Materials Technology, or Mechanical Engineering.
• Strong architectural thinking, critical judgment, and structured problem-solving skills.
• Business fluent in English (written and spoken).
• Excellent communication skills and ability to work in a global, intercultural environment.
• Energetic, result-driven mindset with ambition for professional growth.

Nice to have

• Relevant professional experience in semiconductor packaging.
• Experience in thermomechanical simulation.
• German language skills.

Culture & Benefits

• Unlimited employment contract with competitive compensation.
• Flexible working hours and overtime reduction options.
• Comprehensive training and career development programs.
• Retirement provisions and travel allowance for public transport.
• Access to employee resource groups and inclusive workplace initiatives.