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2 часа назад

Senior Advanced Packaging & Power Delivery Engineer (AI)

Формат работы
remote (только Europe)/hybrid/onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
France/UK/Serbia +29 еще
Релокация
Netherlands/Italy
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR

Senior Advanced Packaging & Power Delivery Engineer (AI): Designing and optimizing power-delivery architectures for next-generation AI accelerators with an accent on multi-chiplet integration and 3D-stacked systems. Focus on end-to-end PDN design, SI/PI verification, and collaborating with cross-functional R&D teams to scale high-performance silicon products.

Location: Must be based in Europe (including UK) or willing to relocate to Italy or the Netherlands.

Company

hirify.global is a fast-growing deep-tech startup building a next-generation AI platform with a global team of experts and significant venture backing.

What you will do

  • Own power-delivery design from on-die grids to package and PCB PDN.
  • Lead advanced packaging architecture for 2.5D/3D stacking and multi-chiplet integration.
  • Perform full-stack SI/PI verification and sign-off to ensure performance targets.
  • Collaborate with Silicon Engineering and AI Integrated Systems teams on product requirements.
  • Develop and maintain power-delivery methodologies and design guidelines.
  • Engage with OSAT partners and substrate vendors to co-develop packaging solutions.

Requirements

  • Bachelor’s or Master’s degree in Electrical Engineering or Microelectronics.
  • 7+ years of experience in power delivery or advanced packaging design.
  • Expertise in on-die power grid design and package/PCB PDN analysis.
  • Hands-on experience with 2.5D/3D IC packaging and interposer/substrate co-design.
  • Proficiency with industry-standard EDA tools for power integrity and simulation.
  • Strong written and spoken English communication skills.

Nice to have

  • Experience with SI/PI verification and sign-off methodologies.
  • Familiarity with thermal modeling and co-simulation.
  • Exposure to AI accelerator or custom ASIC design flows.
  • Experience collaborating with OSAT partners or research institutes like imec.

Culture & Benefits

  • Attractive compensation package including pension and insurance.
  • Equity participation through company shares.
  • Flexible working arrangements with remote and office-based options.
  • Open culture supporting creativity, innovation, and collaborative ownership.
  • Inclusive environment celebrating diversity and global teamwork.

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