Advanced Packaging Reliability Engineer (AI)

TL;DR

Advanced Packaging Reliability Engineer (AI): Leading reliability engineering for advanced packages in high-performance AI systems with an accent on mechanical and thermal reliability risks. Focus on thermo-mechanical modeling, root-cause analysis of failure mechanisms, and optimizing package design for AI-native silicon.

Location: San Francisco, USA. Candidates must meet U.S. export control legal status requirements.

Salary: $266,000 – $445,000 + Equity

Company

hirify.global is an AI research and deployment company dedicated to ensuring that general-purpose artificial intelligence benefits all of humanity.

What you will do

• Lead reliability test plans and assessments for advanced HPC packages, including risk identification and root-cause investigation.
• Drive package design optimization using thermo-mechanical modeling to improve power integrity and thermal performance.
• Develop and validate lifetime-prediction methodologies for assembly and product operating conditions.
• Evaluate and recommend package architectures, materials, and assembly processes to maximize robustness.
• Predict electromigration lifetime of package interconnects under product-specific workloads and boundary conditions.

Requirements

• 8+ years of industry experience in semiconductor package reliability and failure mechanisms.
• Deep knowledge of advanced packaging architectures (2.5D/3.5D, chiplets, HBM integration, interposers).
• Strong experience with thermal and mechanical finite-element modeling (FEA) of packages.
• Expertise in package-material behavior, including CTE, viscoelasticity, and fracture toughness.
• MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, Physics, or a related field.
• Must meet U.S. export control laws and regulations legal status requirements.

Culture & Benefits

• Opportunity to work on cutting-edge AI-native silicon and supercomputing infrastructure.
• Collaborative environment working across chip, package, cooling, and system levels.
• Competitive compensation package including significant equity.
• Inclusive workplace committed to equal opportunity and diverse perspectives.