Packaging Thermal Engineer (Semiconductor)

TL;DR

Packaging Thermal Engineer (Semiconductor): Performing thermal analysis and validation for advanced semiconductor packaging solutions with an accent on CFD simulation, thermal test vehicle design, and model-to-hardware correlation. Focus on optimizing thermal performance for complex 2.5D/3D packaging architectures and collaborating with internal design teams and external suppliers.

Location: Hsinchu, Taiwan (Hybrid)

Company

hirify.global is a global leader in semiconductor manufacturing and technology innovation, driving the future of computing through advanced hardware and strategic planning.

What you will do

• Design and develop Thermal Test Vehicles (TTV) from concept through fabrication and experimental validation.
• Perform thermal simulations using CFD solvers to architect product designs and ensure thermal performance.
• Establish robust methodologies for correlating simulation results with physical measurement data.
• Develop compact thermal models (CTMs) and reduced-order models (ROMs) for system-level integration.
• Collaborate with internal product design and pathfinding engineers to optimize thermal-mechanical performance.
• Identify and scout thermal technology roadmaps to contribute to future product architectures.

Requirements

• Bachelor or Master degree in Mechanical Engineering or a related field.
• 5+ years of experience in thermal simulation analysis and measurement characterization for packaging.
• Deep expertise in heat transfer fundamentals and electronics cooling.
• Proficiency with CFD tools such as Icepak or FloTHERM.
• Hands-on experience with thermal measurement techniques like thermocouples and IR.
• Experience with packaging thermal materials including integrated heat sinks and thermal interface materials.

Nice to have

• Experience with thermal-mechanical simulation.
• Knowledge of advanced packaging technologies (2.5D to 3D).

Culture & Benefits

• Hybrid work model allowing flexibility between on-site and off-site work.
• Opportunity to work within the Corporate Planning Group on cutting-edge semiconductor technologies.
• Commitment to ethical hiring practices and Responsible Business Alliance (RBA) compliance.