Project Leader (Backend Package R&D)

TL;DR

Project Leader (Backend Package R&D): Leading a team of project leaders to ensure successful execution of semiconductor R&D projects with an accent on project governance, timeline management, and cost control. Focus on driving cross-functional coordination, mitigating technical and schedule risks, and ensuring compliance with IATF 16949 quality standards.

Location: Seremban, Malaysia

Company

hirify.global is a global semiconductor manufacturer dedicated to delivering high-quality components and fostering an inclusive, diverse work environment.

What you will do

• Lead, supervise, and develop a team of project leaders to achieve project goals.
• Define and manage overall project plans in alignment with stakeholders and management.
• Monitor project progress, provide clear reporting, and escalate issues when necessary.
• Identify, analyze, and mitigate project risks including technical, cost, and schedule factors.
• Ensure compliance with quality standards, specifically IATF 16949 requirements.
• Collaborate with Finance on Die Free Package Cost (DFPC) and cost planning.

Requirements

• Bachelor’s degree in engineering.
• At least 6+ years of experience in a semiconductor manufacturing environment.
• Strong project management and leadership experience.
• Knowledge of process engineering and manufacturing workflows.
• Familiarity with quality systems, especially IATF 16949 and PFMEA.
• Strong analytical thinking and structured problem-solving skills.

Culture & Benefits

• Commitment to diversity and inclusion with active employee resource groups.
• Support for professional development and leadership growth.
• Focus on innovation and continuous improvement in project execution.
• Equal-opportunity employer with a dedication to a safe and accessible work environment.